JPH0263590U - - Google Patents
Info
- Publication number
- JPH0263590U JPH0263590U JP14289088U JP14289088U JPH0263590U JP H0263590 U JPH0263590 U JP H0263590U JP 14289088 U JP14289088 U JP 14289088U JP 14289088 U JP14289088 U JP 14289088U JP H0263590 U JPH0263590 U JP H0263590U
- Authority
- JP
- Japan
- Prior art keywords
- board
- metal case
- electronic component
- component
- component module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の電子部品モジユールの一実施
例の縦断面図である。
１…部品、２…金属ケース、３…基板、４…貫
通穴、５…半田、６…半田。
FIG. 1 is a longitudinal sectional view of one embodiment of the electronic component module of the present invention. 1... Part, 2... Metal case, 3... Board, 4... Through hole, 5... Solder, 6... Solder.
Claims (1)
になるように金属ケースを被せて前記基板と前記
金属ケースとが隙間なく半田付けされる電子部品
モジユールにおいて、前記基板に半田シールでき
る通気用の貫通穴を備えたことを特徴とする電子
部品モジユール。 In an electronic component module in which a component is mounted on one side of a board, a metal case is placed over the board so that the component is on the inside, and the board and the metal case are soldered without any gaps, a ventilator that can be solder-sealed to the board is used. An electronic component module characterized by having a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14289088U JPH0263590U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14289088U JPH0263590U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263590U true JPH0263590U (en) | 1990-05-11 |
Family
ID=31409220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14289088U Pending JPH0263590U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263590U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7940944B2 (en) | 2006-05-09 | 2011-05-10 | Bse Co., Ltd. | Directional silicon condenser microphone having additional back chamber |
| US7949142B2 (en) | 2006-05-09 | 2011-05-24 | Bse Co., Ltd. | Silicon condenser microphone having additional back chamber and sound hole in PCB |
-
1988
- 1988-10-31 JP JP14289088U patent/JPH0263590U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7940944B2 (en) | 2006-05-09 | 2011-05-10 | Bse Co., Ltd. | Directional silicon condenser microphone having additional back chamber |
| US7949142B2 (en) | 2006-05-09 | 2011-05-24 | Bse Co., Ltd. | Silicon condenser microphone having additional back chamber and sound hole in PCB |
| US7953235B2 (en) | 2006-05-09 | 2011-05-31 | Bse Co., Ltd. | Directional silicon condenser microphone having additional back chamber |
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