JPH0327069U - - Google Patents
Info
- Publication number
- JPH0327069U JPH0327069U JP8707289U JP8707289U JPH0327069U JP H0327069 U JPH0327069 U JP H0327069U JP 8707289 U JP8707289 U JP 8707289U JP 8707289 U JP8707289 U JP 8707289U JP H0327069 U JPH0327069 U JP H0327069U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lead
- solder
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は同じくこの考案の他の実施例を示す断面図
、第３図は従来の回路基板を示す断面図である。
なお、５……印刷基板、７……電子部品、８…
…リード、９……半田である。
FIG. 1 is a sectional view showing one embodiment of this invention, FIG. 2 is a sectional view showing another embodiment of this invention, and FIG. 3 is a sectional view showing a conventional circuit board. In addition, 5...printed circuit board, 7...electronic component, 8...
...Lead, 9...Solder.
Claims (1)
と、このリードに接続され上記印刷基板に載置さ
れる電子部品と、上記リードを印刷基板に固着さ
せる半田とを備え、上記リードを上記印刷基板よ
り０．７〜０．９mmの範囲に突設させデイツプ半
田付したことを特徴とする回路基板。 A printed circuit board, a lead inserted into the printed circuit board, an electronic component connected to the lead and mounted on the printed circuit board, and a solder that fixes the lead to the printed circuit board, and the lead is connected to the printed circuit board. A circuit board characterized in that it protrudes within a range of 0.7 to 0.9 mm and is dip soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8707289U JPH0327069U (en) | 1989-07-25 | 1989-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8707289U JPH0327069U (en) | 1989-07-25 | 1989-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0327069U true JPH0327069U (en) | 1991-03-19 |
Family
ID=31636726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8707289U Pending JPH0327069U (en) | 1989-07-25 | 1989-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0327069U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102069703B1 (en) * | 2019-04-19 | 2020-02-11 | 주식회사 토스 | Glasses frame assembly with improved fit |
-
1989
- 1989-07-25 JP JP8707289U patent/JPH0327069U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102069703B1 (en) * | 2019-04-19 | 2020-02-11 | 주식회사 토스 | Glasses frame assembly with improved fit |
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