JPS61177473U - - Google Patents
Info
- Publication number
- JPS61177473U JPS61177473U JP6068385U JP6068385U JPS61177473U JP S61177473 U JPS61177473 U JP S61177473U JP 6068385 U JP6068385 U JP 6068385U JP 6068385 U JP6068385 U JP 6068385U JP S61177473 U JPS61177473 U JP S61177473U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic component
- board body
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係るプリント基板に各種の電
子部品を搭載した部品面の一部を示す斜視図、第
２図は第１図の裏面（はんだ面）の一部拡大斜視
図である。
１……プリント基板本体、１ａ……部品面、１
ｂ……はんだ面、２〜７……電子部品、８……は
んだ付け部分、９……導電パターン、１０……ス
ルーホール、１１……端子、１２……貫通孔。
FIG. 1 is a perspective view showing a part of the component surface on which various electronic components are mounted on a printed circuit board according to the present invention, and FIG. 2 is a partially enlarged perspective view of the back surface (solder surface) of FIG. 1... Printed circuit board body, 1a... Component side, 1
b... Solder surface, 2 to 7... Electronic component, 8... Soldering part, 9... Conductive pattern, 10... Through hole, 11... Terminal, 12... Through hole.
Claims (1)
と対面した該基板本体位置に、当該電子部品の押
出し用の貫通孔を穿設したことを特徴とするプリ
ント基板。 1. A printed circuit board, characterized in that a through hole for extruding the electronic component is formed at a position of the printed circuit board body facing the lower part of the electronic component mounted on the printed circuit board body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6068385U JPS61177473U (en) | 1985-04-22 | 1985-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6068385U JPS61177473U (en) | 1985-04-22 | 1985-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61177473U true JPS61177473U (en) | 1986-11-05 |
Family
ID=30588259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6068385U Pending JPS61177473U (en) | 1985-04-22 | 1985-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177473U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4419871Y1 (en) * | 1966-07-04 | 1969-08-26 |
-
1985
- 1985-04-22 JP JP6068385U patent/JPS61177473U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4419871Y1 (en) * | 1966-07-04 | 1969-08-26 |