JPH0227739U - - Google Patents

Info

Publication number
JPH0227739U
JPH0227739U JP10567088U JP10567088U JPH0227739U JP H0227739 U JPH0227739 U JP H0227739U JP 10567088 U JP10567088 U JP 10567088U JP 10567088 U JP10567088 U JP 10567088U JP H0227739 U JPH0227739 U JP H0227739U
Authority
JP
Japan
Prior art keywords
leads
electronic component
wiring board
printed wiring
self
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10567088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10567088U priority Critical patent/JPH0227739U/ja
Publication of JPH0227739U publication Critical patent/JPH0227739U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案の一実施例である電子部品の
外観斜視図、第２図は電子部品の部分外観図、第
３図は従来の電子部品の外観斜視図、第４図はこ
の電子部品の部分外観図である。 １……電子部品本体、３……パツド、４……印
刷配線板、５……ハンダ、２０……リード。 Fig. 1 is an external perspective view of an electronic component that is an embodiment of this invention, Fig. 2 is a partial external view of the electronic component, Fig. 3 is an external perspective view of a conventional electronic component, and Fig. 4 is this electronic component. FIG. 1... Electronic component body, 3... Pad, 4... Printed wiring board, 5... Solder, 20... Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 本体から水平方向に四方より突出する複数のリ
ードを有し、リフローハンダ付により印刷配線基
板上に実装される電子部品において、上記リード
の長さまたは幅を大きくしセルフアライメント効
果を大きくしたことを特徴とする電子部品。 In an electronic component that has multiple leads that protrude horizontally from the main body from all sides and is mounted on a printed wiring board by reflow soldering, the self-alignment effect is increased by increasing the length or width of the leads. Featured electronic components.
JP10567088U 1988-08-10 1988-08-10 Pending JPH0227739U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10567088U JPH0227739U (en) 1988-08-10 1988-08-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10567088U JPH0227739U (en) 1988-08-10 1988-08-10

Publications (1)

Publication Number Publication Date
JPH0227739U true JPH0227739U (en) 1990-02-22

Family

ID=31338492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10567088U Pending JPH0227739U (en) 1988-08-10 1988-08-10

Country Status (1)

Country Link
JP (1) JPH0227739U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062351A (en) * 2011-09-13 2013-04-04 Alps Green Devices Co Ltd Mounting structure for electronic component
JPWO2016063396A1 (en) * 2014-10-23 2017-04-27 三菱電機株式会社 Wiring board, electric motor, electrical equipment and air conditioner

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062351A (en) * 2011-09-13 2013-04-04 Alps Green Devices Co Ltd Mounting structure for electronic component
JPWO2016063396A1 (en) * 2014-10-23 2017-04-27 三菱電機株式会社 Wiring board, electric motor, electrical equipment and air conditioner

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