JPH0217854U - - Google Patents
Info
- Publication number
- JPH0217854U JPH0217854U JP9534488U JP9534488U JPH0217854U JP H0217854 U JPH0217854 U JP H0217854U JP 9534488 U JP9534488 U JP 9534488U JP 9534488 U JP9534488 U JP 9534488U JP H0217854 U JPH0217854 U JP H0217854U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- soldering
- circuit board
- printed circuit
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
該一実施例の外部リードの拡大図、第３図は該一
実施例の外部リードがプリント基板にはんだ付け
された状態を示す断面図、第４図は本考案の他の
実施例の外部リードの拡大図、第５図は該他の実
施例の外部リードがプリント基板にはんだ付けさ
れた状態を示す断面図である。
１……パツケージ、２，７……外部リード、３
，８……はんだ付け面、４……穴、５，１１……
プリント基板、６，１０……はんだ、９……溝。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is an enlarged view of the external leads of the embodiment, and Fig. 3 shows the external leads of the embodiment soldered to a printed circuit board. FIG. 4 is an enlarged view of an external lead according to another embodiment of the present invention, and FIG. 5 is a sectional view showing the external lead of the other embodiment soldered to a printed circuit board. 1...Package, 2, 7...External lead, 3
, 8... Soldering surface, 4... Hole, 5, 11...
Printed circuit board, 6, 10...solder, 9...groove.
Claims (1)
外部リードを有する半導体装置において、外部リ
ードのはんだ付け面に穴又は溝を有することを特
徴とする半導体装置。 1. A semiconductor device having external leads for mounting on a printed circuit board by soldering, the semiconductor device having a hole or groove on the soldering surface of the external lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534488U JPH0217854U (en) | 1988-07-18 | 1988-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534488U JPH0217854U (en) | 1988-07-18 | 1988-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217854U true JPH0217854U (en) | 1990-02-06 |
Family
ID=31320009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9534488U Pending JPH0217854U (en) | 1988-07-18 | 1988-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217854U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009124095A (en) * | 2007-11-12 | 2009-06-04 | Samsung Sdi Co Ltd | Semiconductor package and mounting method thereof |
| JP2017041541A (en) * | 2015-08-20 | 2017-02-23 | 三菱電機株式会社 | High-frequency high-output device |
-
1988
- 1988-07-18 JP JP9534488U patent/JPH0217854U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009124095A (en) * | 2007-11-12 | 2009-06-04 | Samsung Sdi Co Ltd | Semiconductor package and mounting method thereof |
| US8319319B2 (en) | 2007-11-12 | 2012-11-27 | Samsung Sdi Co., Ltd. | Semiconductor package and mounting method thereof |
| JP2017041541A (en) * | 2015-08-20 | 2017-02-23 | 三菱電機株式会社 | High-frequency high-output device |
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