JPS6273549U - - Google Patents

Info

Publication number
JPS6273549U
JPS6273549U JP16427285U JP16427285U JPS6273549U JP S6273549 U JPS6273549 U JP S6273549U JP 16427285 U JP16427285 U JP 16427285U JP 16427285 U JP16427285 U JP 16427285U JP S6273549 U JPS6273549 U JP S6273549U
Authority
JP
Japan
Prior art keywords
board
integrated circuit
case
semiconductor integrated
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16427285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16427285U priority Critical patent/JPS6273549U/ja
Publication of JPS6273549U publication Critical patent/JPS6273549U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す上面図、第2
図は第1図に示す実施例の横断面図である。 1……ケース、2……リード、3……突起、4
……ペースト状半田、5……パツド、6……プリ
ント基板、7……スルーホール。
Fig. 1 is a top view showing one embodiment of the present invention;
The figure is a cross-sectional view of the embodiment shown in FIG. 1. 1...Case, 2...Lead, 3...Protrusion, 4
... Paste solder, 5... Padded, 6... Printed circuit board, 7... Through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子回路に使用される半導体集積回路であつて
プリント基板等に半田付によつて実装されるに際
して基板のスルーホールを介さず基板表面に設け
られたパツドを介して半田付されるいわゆる表面
実装型集積回路において、前記プリント基板に面
する側の表面に複数の突起を設けたケースと、前
記ケースに収容された集積回路とを含むことを特
徴とする半導体集積回路。
A so-called surface mount type semiconductor integrated circuit used in electronic circuits that is soldered onto a printed circuit board, etc., through pads provided on the surface of the board rather than through through holes in the board. 1. A semiconductor integrated circuit comprising: a case having a plurality of protrusions on a surface facing the printed circuit board; and an integrated circuit housed in the case.
JP16427285U 1985-10-25 1985-10-25 Pending JPS6273549U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16427285U JPS6273549U (en) 1985-10-25 1985-10-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16427285U JPS6273549U (en) 1985-10-25 1985-10-25

Publications (1)

Publication Number Publication Date
JPS6273549U true JPS6273549U (en) 1987-05-11

Family

ID=31093236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16427285U Pending JPS6273549U (en) 1985-10-25 1985-10-25

Country Status (1)

Country Link
JP (1) JPS6273549U (en)

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