JPH0295247U - - Google Patents
Info
- Publication number
- JPH0295247U JPH0295247U JP365689U JP365689U JPH0295247U JP H0295247 U JPH0295247 U JP H0295247U JP 365689 U JP365689 U JP 365689U JP 365689 U JP365689 U JP 365689U JP H0295247 U JPH0295247 U JP H0295247U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- printed circuit
- chip carrier
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案に於けるチツプキヤリアＩＣ
の実施例を示す平面図。第２図は、従来のチツプ
キヤリアＩＣの平面図。
１…プリント基板、２…プリント基板の辺部に
設けられた外部接続用スルホールメツキ端子（ス
ルホール端子）、３…プリント基板のコーナー部
に設けられた外部接続用スルホールメツキ端子（
コーナー端子）。
Figure 1 shows the chip carrier IC in this invention.
FIG. FIG. 2 is a plan view of a conventional chip carrier IC. 1...Printed board, 2...Through-hole plated terminal for external connection provided on the side of the printed board (through-hole terminal), 3...Through-hole plated terminal for external connection provided in the corner of the printed board (
corner terminal).
Claims (1)
ト基板の配線パターンと該ＩＣチツプを接続し、
樹脂で封止を行なつたチツプキヤリアＩＣに於て
、該チツプキヤリアＩＣの外部接続端子の少なく
とも１つの端子が、該プリント基板のコーナー部
にあり、しかもその端子が他の端子に比べて、は
んだ付けに寄与する端子面積の広いことを特徴と
するチツプキヤリアＩＣ。 Fixing an IC chip to a printed circuit board, connecting the wiring pattern of the printed circuit board and the IC chip,
In a chip carrier IC sealed with resin, at least one of the external connection terminals of the chip carrier IC is located at a corner of the printed circuit board, and that terminal is soldered more easily than other terminals. A chip carrier IC characterized by a large terminal area that contributes to
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP365689U JPH0295247U (en) | 1989-01-17 | 1989-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP365689U JPH0295247U (en) | 1989-01-17 | 1989-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295247U true JPH0295247U (en) | 1990-07-30 |
Family
ID=31205486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP365689U Pending JPH0295247U (en) | 1989-01-17 | 1989-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295247U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083354A (en) * | 1983-10-14 | 1985-05-11 | Oki Electric Ind Co Ltd | Substrate for chip carrier |
-
1989
- 1989-01-17 JP JP365689U patent/JPH0295247U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083354A (en) * | 1983-10-14 | 1985-05-11 | Oki Electric Ind Co Ltd | Substrate for chip carrier |
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