JPS58118774U - electronic circuit package - Google Patents

electronic circuit package

Info

Publication number
JPS58118774U
JPS58118774U JP1982016186U JP1618682U JPS58118774U JP S58118774 U JPS58118774 U JP S58118774U JP 1982016186 U JP1982016186 U JP 1982016186U JP 1618682 U JP1618682 U JP 1618682U JP S58118774 U JPS58118774 U JP S58118774U
Authority
JP
Japan
Prior art keywords
electronic circuit
circuit package
ceramic case
external connection
signal pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982016186U
Other languages
Japanese (ja)
Inventor
本田　和夫
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982016186U priority Critical patent/JPS58118774U/en
Publication of JPS58118774U publication Critical patent/JPS58118774U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の電子回路パッケージの斜視図、第２図は
本考案電子回路パッケージの一実施例の斜視図、第３図
は第２図のＡ−Ａ断面を示す図である。 １・・・電子回路パッケージ、２・・・印刷配線板、３
゜１３・・・セラミックケース、４．１４・・・外部接
続端子１．５・・・銅箔部、６・・・パターン、１２・
・・角穴、１５・・・印刷配線モジュール、１６．　２
７．　２８゜２９．３０・・・部品ホール、１８．　４
１．　４３・・・信号パターン、１７．４２・・・スル
ーホール、２０゜２１．２２．２３・・・印刷配線要素
、２４．　２５゜２６・・・絶縁層。FIG. 1 is a perspective view of a conventional electronic circuit package, FIG. 2 is a perspective view of an embodiment of the electronic circuit package of the present invention, and FIG. 3 is a cross-sectional view taken along line AA in FIG. 1...Electronic circuit package, 2...Printed wiring board, 3
゜13...Ceramic case, 4.14...External connection terminal 1.5...Copper foil part, 6...Pattern, 12.
...Square hole, 15...Printed wiring module, 16. 2
7. 28°29.30...Parts hole, 18. 4
1. 43...Signal pattern, 17.42...Through hole, 20°21.22.23...Printed wiring element, 24. 25°26...Insulating layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] マトリックス状の外部接続端子を表裏両面にもつ半導体
チップ内蔵のセラミックケースと、該セラミックケース
を収容する角穴、前記セラミックケースの前記角穴の周
辺に設けられ外部接続端子と接続される半円状の部品ホ
ール、該部品ホール間を結ぶ信号パターン、該信号パタ
ーンの層変換を行なうスルーホールを有する印刷配線モ
ジュールとを含むことを特徴とする電子回路パッケージ
。a ceramic case with a built-in semiconductor chip having matrix-shaped external connection terminals on both the front and back sides; a square hole for accommodating the ceramic case; and a semicircular shape provided around the square hole of the ceramic case and connected to the external connection terminals. 1. An electronic circuit package comprising component holes, a signal pattern connecting the component holes, and a printed wiring module having a through hole for layer conversion of the signal pattern.
JP1982016186U 1982-02-08 1982-02-08 electronic circuit package Pending JPS58118774U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982016186U JPS58118774U (en) 1982-02-08 1982-02-08 electronic circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982016186U JPS58118774U (en) 1982-02-08 1982-02-08 electronic circuit package

Publications (1)

Publication Number Publication Date
JPS58118774U true JPS58118774U (en) 1983-08-13

Family

ID=30028562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982016186U Pending JPS58118774U (en) 1982-02-08 1982-02-08 electronic circuit package

Country Status (1)

Country Link
JP (1) JPS58118774U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092693A (en) * 1983-10-27 1985-05-24 富士通株式会社 High density mounting structure
JPH1174648A (en) * 1997-08-27 1999-03-16 Kyocera Corp Wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092693A (en) * 1983-10-27 1985-05-24 富士通株式会社 High density mounting structure
JPH1174648A (en) * 1997-08-27 1999-03-16 Kyocera Corp Wiring board

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