JPS606269U - Substrate for hybrid integrated circuits - Google Patents

Substrate for hybrid integrated circuits

Info

Publication number
JPS606269U
JPS606269U JP9920983U JP9920983U JPS606269U JP S606269 U JPS606269 U JP S606269U JP 9920983 U JP9920983 U JP 9920983U JP 9920983 U JP9920983 U JP 9920983U JP S606269 U JPS606269 U JP S606269U
Authority
JP
Japan
Prior art keywords
hybrid integrated
substrate
integrated circuits
boards
soldering terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9920983U
Other languages
Japanese (ja)
Inventor
楢本　剛久
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP9920983U priority Critical patent/JPS606269U/en
Publication of JPS606269U publication Critical patent/JPS606269U/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の接続方法、第２図は本考案の一実施例、
第３図は接続金具の用途別形状、第４図は接続金具の詳
細図である。 図において２は半導体素子、３は端子、１１および１２
は基板、１３および１４は半田付端子、１５は金具、１
６〜２０は端子を示す。Figure 1 shows a conventional connection method, Figure 2 shows an embodiment of the present invention,
FIG. 3 shows the shapes of the connecting fittings according to their usage, and FIG. 4 shows the details of the connecting fittings. In the figure, 2 is a semiconductor element, 3 is a terminal, 11 and 12
is a board, 13 and 14 are soldered terminals, 15 is a metal fitting, 1
6 to 20 indicate terminals.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両面に配線パターンおよび半田付端子を有する複数枚の
基板、並びに隣接する該基板の半田付端子および該基板
の両面にある半田付端子の間を、機械的且つ電気的に接
続する金具を組合せて半田付けし、一枚の基板にしたこ
とを特徴とする混成集積回路用基板。A combination of multiple boards having wiring patterns and soldering terminals on both sides, and metal fittings for mechanically and electrically connecting the soldering terminals on adjacent boards and the soldering terminals on both sides of the boards. A hybrid integrated circuit board characterized by being soldered into a single board.
JP9920983U 1983-06-27 1983-06-27 Substrate for hybrid integrated circuits Pending JPS606269U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9920983U JPS606269U (en) 1983-06-27 1983-06-27 Substrate for hybrid integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9920983U JPS606269U (en) 1983-06-27 1983-06-27 Substrate for hybrid integrated circuits

Publications (1)

Publication Number Publication Date
JPS606269U true JPS606269U (en) 1985-01-17

Family

ID=30235211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9920983U Pending JPS606269U (en) 1983-06-27 1983-06-27 Substrate for hybrid integrated circuits

Country Status (1)

Country Link
JP (1) JPS606269U (en)

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