JPS60106363U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS60106363U JPS60106363U JP1983197443U JP19744383U JPS60106363U JP S60106363 U JPS60106363 U JP S60106363U JP 1983197443 U JP1983197443 U JP 1983197443U JP 19744383 U JP19744383 U JP 19744383U JP S60106363 U JPS60106363 U JP S60106363U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- lead terminals
- solder resist
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の一実施例を示す要部斜視図であり、第
2図はその平面図であり、第3図は第2図のA−A’線
断面図であり、第4図は第2図の13−B’線断面図で
あり、第5図は本考案の他の実施例を示す要部平面図で
ある。
1・・・プリント配線基板、2・・・集積回路部品、4
.5・・・導出用リード端子、7・・・導出用リード端
子に接続する導電パターン部、8・・・電気回路構成用
の導電パターン部、9・・・半田レジスト層、12・・
・絶縁層。FIG. 1 is a perspective view of essential parts showing an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a sectional view taken along line A-A' in FIG. 2, and FIG. 2 is a sectional view taken along the line 13-B' in FIG. 2, and FIG. 5 is a plan view of main parts showing another embodiment of the present invention. 1... Printed wiring board, 2... Integrated circuit component, 4
.. 5... Lead terminal for lead-out, 7... Conductive pattern portion connected to the lead terminal for lead-out, 8... Conductive pattern portion for electrical circuit configuration, 9... Solder resist layer, 12...
・Insulating layer.
Claims (1)
るプリント配線基板上に形成された導電パターンのうち
、上記多数の導出用リード端子中の不要の導出用リード
端子が対向する部分に半田レジスト層を被着゛するとと
もに、この半田レジスト層上に文字、数字、マーク等を
構成する表示用印刷層と同物質で且つ該表示用印刷層の
形晟工程で形成される絶縁層を被着してなるプリント配
線基板。Of a conductive pattern formed on a printed wiring board on which an electronic component having a large number of lead terminals is mounted, a solder resist layer is applied to a portion facing unnecessary lead terminals among the large number of lead terminals. At the same time, on this solder resist layer, an insulating layer made of the same material as the display print layer constituting letters, numbers, marks, etc., and formed in the shaping process of the display print layer is coated. A printed wiring board.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983197443U JPS60106363U (en) | 1983-12-22 | 1983-12-22 | printed wiring board |
KR2019840012245U KR900009645Y1 (en) | 1983-12-22 | 1984-11-27 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983197443U JPS60106363U (en) | 1983-12-22 | 1983-12-22 | printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60106363U true JPS60106363U (en) | 1985-07-19 |
Family
ID=30755745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983197443U Pending JPS60106363U (en) | 1983-12-22 | 1983-12-22 | printed wiring board |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS60106363U (en) |
KR (1) | KR900009645Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62204367U (en) * | 1986-06-17 | 1987-12-26 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5399465A (en) * | 1977-02-10 | 1978-08-30 | Nippon Electric Co | Hyb ic |
-
1983
- 1983-12-22 JP JP1983197443U patent/JPS60106363U/en active Pending
-
1984
- 1984-11-27 KR KR2019840012245U patent/KR900009645Y1/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5399465A (en) * | 1977-02-10 | 1978-08-30 | Nippon Electric Co | Hyb ic |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62204367U (en) * | 1986-06-17 | 1987-12-26 |
Also Published As
Publication number | Publication date |
---|---|
KR900009645Y1 (en) | 1990-10-15 |
KR850009733U (en) | 1985-12-05 |
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