JPS60183468U - Conductor pattern shape of board - Google Patents

Conductor pattern shape of board

Info

Publication number
JPS60183468U
JPS60183468U JP6974484U JP6974484U JPS60183468U JP S60183468 U JPS60183468 U JP S60183468U JP 6974484 U JP6974484 U JP 6974484U JP 6974484 U JP6974484 U JP 6974484U JP S60183468 U JPS60183468 U JP S60183468U
Authority
JP
Japan
Prior art keywords
pattern shape
board
conductor
conductor pattern
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6974484U
Other languages
Japanese (ja)
Inventor
勇二 高波
石井　修司
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP6974484U priority Critical patent/JPS60183468U/en
Publication of JPS60183468U publication Critical patent/JPS60183468U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す導体の単体平面図、第
２図はその配置を示す平面図、第３図はフラットパッケ
ージ型ＬＳＩの平面図、第４図はその側面図、第５図は
印刷配線基板上の従来の導体パターンの平面図である。 １・・・フラットパッケージ型ＬＳＩ、　：＞・・・端
子、３．４・・・導体、４ａ・・・半田付保証部分、４
ｂ・・・リード線部分。Fig. 1 is a plan view of a single conductor showing an embodiment of the present invention, Fig. 2 is a plan view showing its arrangement, Fig. 3 is a plan view of a flat package type LSI, and Fig. 4 is a side view thereof. FIG. 5 is a plan view of a conventional conductor pattern on a printed wiring board. 1...Flat package type LSI, :>...terminal, 3.4...conductor, 4a...soldering guaranteed part, 4
b...Lead wire part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品を搭載する基板の導体パターン形状において、
導体が幅の広い半田付保証部分と幅の狭いリード線部分
とからなり、該導体の半田付保証部分とリード線部分が
交互に位置するように形成することを特徴と１−だ基板
の導体パターン形状。In the conductor pattern shape of the board on which electronic components are mounted,
A conductor of a single-sided board, characterized in that the conductor is formed of a wide soldering guaranteed part and a narrow lead wire part, and the soldering guaranteed part and the lead wire part of the conductor are arranged alternately. pattern shape.
JP6974484U 1984-05-15 1984-05-15 Conductor pattern shape of board Pending JPS60183468U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6974484U JPS60183468U (en) 1984-05-15 1984-05-15 Conductor pattern shape of board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6974484U JPS60183468U (en) 1984-05-15 1984-05-15 Conductor pattern shape of board

Publications (1)

Publication Number Publication Date
JPS60183468U true JPS60183468U (en) 1985-12-05

Family

ID=30605708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6974484U Pending JPS60183468U (en) 1984-05-15 1984-05-15 Conductor pattern shape of board

Country Status (1)

Country Link
JP (1) JPS60183468U (en)

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