JPS5978650U - Printed board - Google Patents

Printed board

Info

Publication number
JPS5978650U
JPS5978650U JP17596982U JP17596982U JPS5978650U JP S5978650 U JPS5978650 U JP S5978650U JP 17596982 U JP17596982 U JP 17596982U JP 17596982 U JP17596982 U JP 17596982U JP S5978650 U JPS5978650 U JP S5978650U
Authority
JP
Japan
Prior art keywords
printed board
solder
circuit board
printed circuit
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17596982U
Other languages
Japanese (ja)
Inventor
卓夫 黒川
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP17596982U priority Critical patent/JPS5978650U/en
Publication of JPS5978650U publication Critical patent/JPS5978650U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のプリント基板の正面図、第2図は本考案
のプリント基板の一実施例を示す正面図、第3図は同プ
リント基板の能吏雄側を示す正面図である。 4・・・配線パターン、5・・・端子、6・・・半田吸
着パターン。
FIG. 1 is a front view of a conventional printed circuit board, FIG. 2 is a front view of an embodiment of the printed circuit board of the present invention, and FIG. 3 is a front view of the same printed circuit board from the Yoshio side. 4... Wiring pattern, 5... Terminal, 6... Solder adsorption pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の配線パターンの半田流に対する下手近傍に半田吸
着パターンを形成してなるプリント基板。
A printed circuit board that has solder adsorption patterns formed near the bottom of a plurality of wiring patterns relative to the solder flow.
JP17596982U 1982-11-19 1982-11-19 Printed board Pending JPS5978650U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17596982U JPS5978650U (en) 1982-11-19 1982-11-19 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17596982U JPS5978650U (en) 1982-11-19 1982-11-19 Printed board

Publications (1)

Publication Number Publication Date
JPS5978650U true JPS5978650U (en) 1984-05-28

Family

ID=30382695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17596982U Pending JPS5978650U (en) 1982-11-19 1982-11-19 Printed board

Country Status (1)

Country Link
JP (1) JPS5978650U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415264U (en) * 1990-05-29 1992-02-06

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415264U (en) * 1990-05-29 1992-02-06

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