JPS5972755U - printed wiring body - Google Patents
printed wiring bodyInfo
- Publication number
- JPS5972755U JPS5972755U JP16848082U JP16848082U JPS5972755U JP S5972755 U JPS5972755 U JP S5972755U JP 16848082 U JP16848082 U JP 16848082U JP 16848082 U JP16848082 U JP 16848082U JP S5972755 U JPS5972755 U JP S5972755U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring body
- grounding pattern
- soldering part
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来のプリント配線体の部分平面図
及びＡ−Ａ線断面図、第３図及び第４図は本考案の前提
となるプリント配線体の部分平面図及びＢ−Ｂ線断面図
、第５図及び第６図は本考案の一実施例を示す部分平面
図及びＣ−Ｃ線断面図、第７図は本考案の他の実施例を
示す部分断面図である。
１・・・・・・プリント基板、２・・・・・・チップ状
電子部品（チップ部品）、３・・・・・・シャーシベー
ス（シールド板）、７・・・・・・アースパターン、１
０・・・・・・アースパターン未形成部分、ｌｌａ、ｌ
ｌｂ・・・・・・半田、ｍ１９ｍ２・・・・・・半田付
は部分。1 and 2 are a partial plan view and a sectional view taken along the line A-A of a conventional printed wiring body, and FIGS. 3 and 4 are a partial plan view and a BB-B of a printed wiring body that is the premise of the present invention. 5 and 6 are a partial plan view and a sectional view taken along the line C--C showing one embodiment of the present invention, and FIG. 7 is a partial sectional view showing another embodiment of the present invention. 1...Printed circuit board, 2...chip electronic component (chip component), 3...chassis base (shield plate), 7...earth pattern, 1
0... Earth pattern not formed part, lla, l
lb...Soldering, m19m2...Soldering is partial.
Claims (1)
付は部分とシールド板半田付は部分を近接させたプリン
ト配線体において、前記アースパターンの各半田付は部
分間にアースパターン未形成部分を形成したことを特徴
とするプリント配線体。A printed wiring body in which a chip component soldering part and a shield plate soldering part are brought close to each other in a grounding pattern of a printed circuit board, characterized in that a part where no grounding pattern is formed is formed between each soldering part of the grounding pattern. Printed wiring body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16848082U JPS5972755U (en) | 1982-11-06 | 1982-11-06 | printed wiring body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16848082U JPS5972755U (en) | 1982-11-06 | 1982-11-06 | printed wiring body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5972755U true JPS5972755U (en) | 1984-05-17 |
Family
ID=30368309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16848082U Pending JPS5972755U (en) | 1982-11-06 | 1982-11-06 | printed wiring body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5972755U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585372B2 (en) * | 1974-12-16 | 1983-01-31 | 株式会社トキメック | Incredible situation |
| JPS5813594B2 (en) * | 1976-06-25 | 1983-03-14 | 古河電気工業株式会社 | Pressure-sensitive heat-melt adhesive composition |
-
1982
- 1982-11-06 JP JP16848082U patent/JPS5972755U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585372B2 (en) * | 1974-12-16 | 1983-01-31 | 株式会社トキメック | Incredible situation |
| JPS5813594B2 (en) * | 1976-06-25 | 1983-03-14 | 古河電気工業株式会社 | Pressure-sensitive heat-melt adhesive composition |
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