JPS5965563U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5965563U
JPS5965563U JP16006982U JP16006982U JPS5965563U JP S5965563 U JPS5965563 U JP S5965563U JP 16006982 U JP16006982 U JP 16006982U JP 16006982 U JP16006982 U JP 16006982U JP S5965563 U JPS5965563 U JP S5965563U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
circuit pattern
pattern
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16006982U
Other languages
Japanese (ja)
Inventor
功刀　雅志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16006982U priority Critical patent/JPS5965563U/en
Publication of JPS5965563U publication Critical patent/JPS5965563U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は電子部品の一例を示す斜視図、第２図は本考案
の一実施例を示す斜視図および第３図は本実施例に電子
部品を実装した状態を示す平面図である。 図において、１・・・・・・電子部品、２・・・・・・
リード線、３・・・・・・プリント配線基板、４・・・
・・・回路名。FIG. 1 is a perspective view showing an example of an electronic component, FIG. 2 is a perspective view showing an embodiment of the present invention, and FIG. 3 is a plan view showing the state in which the electronic component is mounted in this embodiment. In the figure, 1...electronic components, 2...
Lead wire, 3...Printed wiring board, 4...
...Circuit name.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品を実装するための回路パターンが形成されたプ
リンＩ・配線基板において、前記回路パターンのリード
線はんだ材部を千鳥状に形成したことを特徴とするプリ
ント配線基板。1. A printed wiring board on which a circuit pattern for mounting electronic components is formed, characterized in that lead wire solder material portions of the circuit pattern are formed in a staggered pattern.
JP16006982U 1982-10-22 1982-10-22 printed wiring board Pending JPS5965563U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16006982U JPS5965563U (en) 1982-10-22 1982-10-22 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16006982U JPS5965563U (en) 1982-10-22 1982-10-22 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5965563U true JPS5965563U (en) 1984-05-01

Family

ID=30352183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16006982U Pending JPS5965563U (en) 1982-10-22 1982-10-22 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5965563U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61186227U (en) * 1985-05-13 1986-11-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61186227U (en) * 1985-05-13 1986-11-20

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