JPS6146766U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS6146766U
JPS6146766U JP13131784U JP13131784U JPS6146766U JP S6146766 U JPS6146766 U JP S6146766U JP 13131784 U JP13131784 U JP 13131784U JP 13131784 U JP13131784 U JP 13131784U JP S6146766 U JPS6146766 U JP S6146766U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
land
recorded
mesh
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13131784U
Other languages
Japanese (ja)
Inventor
亨 久下
孝明 石井
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP13131784U priority Critical patent/JPS6146766U/en
Publication of JPS6146766U publication Critical patent/JPS6146766U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る印刷配線板の要部平面図であり、
第2区は従来のランド形成構造を示した印刷配線板の要
部平面図である。 11・・・・・・印刷配線板、12・・・・・・ランド
、13・・・・・・導電パターン、14・・・・・・導
電路。
FIG. 1 is a plan view of the main parts of the printed wiring board according to the present invention,
The second section is a plan view of a main part of a printed wiring board showing a conventional land forming structure. 11... Printed wiring board, 12... Land, 13... Conductive pattern, 14... Conductive path.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電パターン内にメッシュ状導電路を介してランドを形
成したことを特徴とする印刷配線板。
A printed wiring board characterized in that a land is formed within a conductive pattern via a mesh-like conductive path.
JP13131784U 1984-08-31 1984-08-31 printed wiring board Pending JPS6146766U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13131784U JPS6146766U (en) 1984-08-31 1984-08-31 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13131784U JPS6146766U (en) 1984-08-31 1984-08-31 printed wiring board

Publications (1)

Publication Number Publication Date
JPS6146766U true JPS6146766U (en) 1986-03-28

Family

ID=30689908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13131784U Pending JPS6146766U (en) 1984-08-31 1984-08-31 printed wiring board

Country Status (1)

Country Link
JP (1) JPS6146766U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218644A (en) * 2007-03-02 2008-09-18 Sumitomo Wiring Syst Ltd Circuit board and circuit board with electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218644A (en) * 2007-03-02 2008-09-18 Sumitomo Wiring Syst Ltd Circuit board and circuit board with electronic component

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