JPS59182974U - Printed board - Google Patents

Printed board

Info

Publication number
JPS59182974U
JPS59182974U JP7851283U JP7851283U JPS59182974U JP S59182974 U JPS59182974 U JP S59182974U JP 7851283 U JP7851283 U JP 7851283U JP 7851283 U JP7851283 U JP 7851283U JP S59182974 U JPS59182974 U JP S59182974U
Authority
JP
Japan
Prior art keywords
printed board
circuit board
printed circuit
recorded
teardrop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7851283U
Other languages
Japanese (ja)
Inventor
厚見　昌良
Original Assignee
株式会社ノーリツ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ノーリツ filed Critical 株式会社ノーリツ
Priority to JP7851283U priority Critical patent/JPS59182974U/en
Publication of JPS59182974U publication Critical patent/JPS59182974U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例のランドを示す説明図、第２図は本考案
の実施例を示す平面図である。 ３・・・・・・ランド、４・・・・・・リード、５・・
・・・・ボール、６・・・・・・プリント基板。FIG. 1 is an explanatory view showing a conventional land, and FIG. 2 is a plan view showing an embodiment of the present invention. 3...Land, 4...Lead, 5...
...ball, 6...printed circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ランド外型を涙滴型としたことを特徴とするプリント基
板。A printed circuit board characterized by having a teardrop-shaped land outer shape.
JP7851283U 1983-05-24 1983-05-24 Printed board Pending JPS59182974U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7851283U JPS59182974U (en) 1983-05-24 1983-05-24 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7851283U JPS59182974U (en) 1983-05-24 1983-05-24 Printed board

Publications (1)

Publication Number Publication Date
JPS59182974U true JPS59182974U (en) 1984-12-06

Family

ID=30208514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7851283U Pending JPS59182974U (en) 1983-05-24 1983-05-24 Printed board

Country Status (1)

Country Link
JP (1) JPS59182974U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997025839A1 (en) * 1996-01-11 1997-07-17 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP2020068271A (en) * 2018-10-23 2020-04-30 田淵電機株式会社 Method for soldering thick copper multilayer substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997025839A1 (en) * 1996-01-11 1997-07-17 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
US6342682B1 (en) 1996-01-11 2002-01-29 Ibiden Co., Ltd. Printed wiring board and manufacturing method thereof
JP2020068271A (en) * 2018-10-23 2020-04-30 田淵電機株式会社 Method for soldering thick copper multilayer substrate

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