JPS5827965U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5827965U
JPS5827965U JP12215481U JP12215481U JPS5827965U JP S5827965 U JPS5827965 U JP S5827965U JP 12215481 U JP12215481 U JP 12215481U JP 12215481 U JP12215481 U JP 12215481U JP S5827965 U JPS5827965 U JP S5827965U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
lands
terminal parts
density terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12215481U
Other languages
Japanese (ja)
Inventor
中屋　久男
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP12215481U priority Critical patent/JPS5827965U/en
Publication of JPS5827965U publication Critical patent/JPS5827965U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来一般のプリント配線基板の要部平面図、第
２図は本考案の１実施例の要部平面図である。 １・・・基板、２・・・ランド、２ａ、　２ｂ、　　２
Ｃ，２ｄ・・・端部ランド、３ａ、　３ｂ、　３Ｃ，３
ｄ・・・空ランド。FIG. 1 is a plan view of a main part of a conventional general printed wiring board, and FIG. 2 is a plan view of a main part of an embodiment of the present invention. 1... Board, 2... Land, 2a, 2b, 2
C, 2d... End land, 3a, 3b, 3C, 3
d...Empty land.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 高密度端子部品を半田ディッピングするプリント配線基
板において、高密度端子部品の両端部に位置する端子に
対応する基板上のランドの外側に空きランドを配設して
なるプリント配線基板。A printed wiring board on which high-density terminal parts are solder-dipped, in which empty lands are arranged outside of lands on the board corresponding to terminals located at both ends of the high-density terminal parts.
JP12215481U 1981-08-17 1981-08-17 printed wiring board Pending JPS5827965U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12215481U JPS5827965U (en) 1981-08-17 1981-08-17 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12215481U JPS5827965U (en) 1981-08-17 1981-08-17 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5827965U true JPS5827965U (en) 1983-02-23

Family

ID=29916082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12215481U Pending JPS5827965U (en) 1981-08-17 1981-08-17 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5827965U (en)

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