JPS59119058U - wiring board - Google Patents

wiring board

Info

Publication number
JPS59119058U
JPS59119058U JP1217183U JP1217183U JPS59119058U JP S59119058 U JPS59119058 U JP S59119058U JP 1217183 U JP1217183 U JP 1217183U JP 1217183 U JP1217183 U JP 1217183U JP S59119058 U JPS59119058 U JP S59119058U
Authority
JP
Japan
Prior art keywords
wiring board
abstract
holes
board
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1217183U
Other languages
Japanese (ja)
Inventor
村田 眞人
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1217183U priority Critical patent/JPS59119058U/en
Publication of JPS59119058U publication Critical patent/JPS59119058U/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の配線基板のスルーホール部の断面図、第
2図は第1図の上面を示す平面図、第3図は本考案に係
る配線基板のスルーホール部の平面図である。 1・・・・・・セラミック基板、2.12・・・・・・
スルーホール孔、3.13・・曲スルーホール厚膜回路
パターン、4・・・・・・裏面側厚膜回路。
FIG. 1 is a sectional view of a through-hole portion of a conventional wiring board, FIG. 2 is a plan view showing the top surface of FIG. 1, and FIG. 3 is a plan view of a through-hole portion of a wiring board according to the present invention. 1...Ceramic substrate, 2.12...
Through-hole hole, 3.13...Curved through-hole thick film circuit pattern, 4...Back side thick film circuit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上下の導電接続がスルーホールにより行なわれてい
る配線基板において、前記スルーホールの孔の形状が長
円形であることを特徴とする配線基板。
1. A wiring board in which conductive connections between the upper and lower sides of the board are made by through holes, wherein the through holes have an oval shape.
JP1217183U 1983-01-31 1983-01-31 wiring board Pending JPS59119058U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1217183U JPS59119058U (en) 1983-01-31 1983-01-31 wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1217183U JPS59119058U (en) 1983-01-31 1983-01-31 wiring board

Publications (1)

Publication Number Publication Date
JPS59119058U true JPS59119058U (en) 1984-08-11

Family

ID=30143575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1217183U Pending JPS59119058U (en) 1983-01-31 1983-01-31 wiring board

Country Status (1)

Country Link
JP (1) JPS59119058U (en)

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