JPS5883172U - multilayer wiring board - Google Patents

multilayer wiring board

Info

Publication number
JPS5883172U
JPS5883172U JP17932481U JP17932481U JPS5883172U JP S5883172 U JPS5883172 U JP S5883172U JP 17932481 U JP17932481 U JP 17932481U JP 17932481 U JP17932481 U JP 17932481U JP S5883172 U JPS5883172 U JP S5883172U
Authority
JP
Japan
Prior art keywords
conductive part
wiring board
multilayer wiring
holes
ceramic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17932481U
Other languages
Japanese (ja)
Inventor
大崎　孝明
修 茨木
橋口　「え」一
森上　義博
Original Assignee
京セラ株式会社
日本電信電話株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社, 日本電信電話株式会社 filed Critical 京セラ株式会社
Priority to JP17932481U priority Critical patent/JPS5883172U/en
Publication of JPS5883172U publication Critical patent/JPS5883172U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の多層配線基板の断面図、第２図は本案に
よる多層配線基板の断面図である。 Ｐ：多層配線基板、Ｃ：セラミック体、Ｔ１．　Ｔ２゜
Ｔ３・・・ニスルーホール、Ｇ□、Ｇ２・・・：平面導
電部、Ｓｌ、Ｇ２．Ｇ３・・・：上面導電部、Ｒ１，Ｒ
２，Ｒ３・・・：下面導電部。FIG. 1 is a sectional view of a conventional multilayer wiring board, and FIG. 2 is a sectional view of a multilayer wiring board according to the present invention. P: Multilayer wiring board, C: Ceramic body, T1. T2゜T3... Varnished through hole, G□, G2...: Planar conductive part, Sl, G2. G3...: Top conductive part, R1, R
2, R3...: Bottom conductive part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表裏面外表面にそれぞれ上面導電部、下面導電部を有し
、それら上、下面導電部を電気的に接続するスルーホー
ル、任意パターンの平面導電部をセラミック体中に埋設
して成る多層配線基板において、上面導電部と下面導電
部の各々に接続されたスルーホールをほぼ同じ垂直関係
位置に形成すると共にそれらスルー央−ル間を平面導電
部と他、　　　のスルーホールとを介して接続したこと
を特徴とする多層配線基板。A multilayer wiring board consisting of a top conductive part and a bottom conductive part on the front and back outer surfaces, through holes for electrically connecting the top and bottom conductive parts, and a planar conductive part in an arbitrary pattern embedded in a ceramic body. The through holes connected to each of the upper conductive part and the lower conductive part are formed at substantially the same vertical position, and the through holes are connected via the plane conductive part and the other through holes. A multilayer wiring board featuring:
JP17932481U 1981-11-30 1981-11-30 multilayer wiring board Pending JPS5883172U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17932481U JPS5883172U (en) 1981-11-30 1981-11-30 multilayer wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17932481U JPS5883172U (en) 1981-11-30 1981-11-30 multilayer wiring board

Publications (1)

Publication Number Publication Date
JPS5883172U true JPS5883172U (en) 1983-06-06

Family

ID=29974918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17932481U Pending JPS5883172U (en) 1981-11-30 1981-11-30 multilayer wiring board

Country Status (1)

Country Link
JP (1) JPS5883172U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156493A (en) * 1984-08-28 1986-03-22 日本電気株式会社 Power source wiring structure of multilayer circuit board
JPS63177586A (en) * 1987-01-19 1988-07-21 株式会社日立製作所 Circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5082559A (en) * 1973-11-26 1975-07-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5082559A (en) * 1973-11-26 1975-07-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156493A (en) * 1984-08-28 1986-03-22 日本電気株式会社 Power source wiring structure of multilayer circuit board
JPS63177586A (en) * 1987-01-19 1988-07-21 株式会社日立製作所 Circuit board

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