JPH0296766U - - Google Patents
Info
- Publication number
- JPH0296766U JPH0296766U JP514389U JP514389U JPH0296766U JP H0296766 U JPH0296766 U JP H0296766U JP 514389 U JP514389 U JP 514389U JP 514389 U JP514389 U JP 514389U JP H0296766 U JPH0296766 U JP H0296766U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead electrodes
- substrates
- substrate
- pulled out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
Description
第１図は、本考案の一実施例の構成を示す断面
図である。第２図は、実施例の要部を示す斜視図
である。
１０……ＨＩＣ、１２，１４……プリント配線
基板、１６〜２２……リード電極。
FIG. 1 is a sectional view showing the structure of an embodiment of the present invention. FIG. 2 is a perspective view showing the main parts of the embodiment. 10...HIC, 12, 14...Printed wiring board, 16-22...Lead electrode.
Claims (1)
電子部品を２枚の基板間に配置し、前記リード電
極を各基板にそれぞれ直接接続したことを特徴と
する電子部品の実装構造。 1. A mounting structure for an electronic component, characterized in that lead electrodes of the electronic component are pulled out vertically, the electronic component is placed between two substrates, and the lead electrodes are directly connected to each substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP514389U JPH0296766U (en) | 1989-01-20 | 1989-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP514389U JPH0296766U (en) | 1989-01-20 | 1989-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296766U true JPH0296766U (en) | 1990-08-01 |
Family
ID=31208260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP514389U Pending JPH0296766U (en) | 1989-01-20 | 1989-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296766U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016510513A (en) * | 2013-01-30 | 2016-04-07 | 日本テキサス・インスツルメンツ株式会社 | Circuit assembly |
-
1989
- 1989-01-20 JP JP514389U patent/JPH0296766U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016510513A (en) * | 2013-01-30 | 2016-04-07 | 日本テキサス・インスツルメンツ株式会社 | Circuit assembly |