JPS61109168U - - Google Patents
Info
- Publication number
- JPS61109168U JPS61109168U JP19386684U JP19386684U JPS61109168U JP S61109168 U JPS61109168 U JP S61109168U JP 19386684 U JP19386684 U JP 19386684U JP 19386684 U JP19386684 U JP 19386684U JP S61109168 U JPS61109168 U JP S61109168U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electronic component
- wiring board
- mounting substrate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
Description
第１図は本考案による電子部品実装構造の一実
施例としての磁気デイスク装置の要部平面図、第
２図は第１図の断面図、第３図は従来の電子部品
実装構造の一例としての磁気デイスク装置の要部
平面図、第４図は第３図の断面図である。
１……実装基体、１ａ，１ｂ……孔、２……第
１電子部品、３……配線基板、３ａ……孔、４…
…第２電子部品、４ａ……リード端子。なお、図
中、同一または相当部分には同一符号を用いてい
る。
FIG. 1 is a plan view of the main parts of a magnetic disk device as an example of an electronic component mounting structure according to the present invention, FIG. 2 is a sectional view of FIG. 1, and FIG. 3 is an example of a conventional electronic component mounting structure. FIG. 4 is a sectional view of FIG. 3. DESCRIPTION OF SYMBOLS 1... Mounting base, 1a, 1b... Hole, 2... First electronic component, 3... Wiring board, 3a... Hole, 4...
...Second electronic component, 4a...Lead terminal. In addition, in the figures, the same reference numerals are used for the same or corresponding parts.
Claims (1)
形成し、この孔を塞ぐように上記実装基板の一方
の面に配線基板を取付け、上記孔に収納した状態
の第２電子部品を上記基板に固定するようにした
電子部品実装構造において、上記配線基板に孔を
形成し、この孔を介して第２電子部品のリード端
子を配線基板の裏面に接続したことを特徴とする
電子部品実装構造。 A hole is formed in the plate-shaped mounting substrate on which the first electronic component is mounted, a wiring board is attached to one surface of the mounting substrate so as to close the hole, and the second electronic component housed in the hole is mounted on the mounting substrate. An electronic component mounting structure fixed to a board, characterized in that a hole is formed in the wiring board, and a lead terminal of a second electronic component is connected to the back surface of the wiring board through the hole. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19386684U JPS61109168U (en) | 1984-12-21 | 1984-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19386684U JPS61109168U (en) | 1984-12-21 | 1984-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61109168U true JPS61109168U (en) | 1986-07-10 |
Family
ID=30751299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19386684U Pending JPS61109168U (en) | 1984-12-21 | 1984-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61109168U (en) |
-
1984
- 1984-12-21 JP JP19386684U patent/JPS61109168U/ja active Pending
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