JPS59171350U - Semiconductor element mounting structure - Google Patents

Semiconductor element mounting structure

Info

Publication number
JPS59171350U
JPS59171350U JP1983065415U JP6541583U JPS59171350U JP S59171350 U JPS59171350 U JP S59171350U JP 1983065415 U JP1983065415 U JP 1983065415U JP 6541583 U JP6541583 U JP 6541583U JP S59171350 U JPS59171350 U JP S59171350U
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting structure
element mounting
wire bonding
bonding position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983065415U
Other languages
Japanese (ja)
Inventor
二郎 橋爪
茂成 高見
達彦 入江
Original Assignee
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式会社 filed Critical 松下電工株式会社
Priority to JP1983065415U priority Critical patent/JPS59171350U/en
Publication of JPS59171350U publication Critical patent/JPS59171350U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48491—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being an additional member attached to the bonding area through an adhesive or solder, e.g. buffer pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は従来例を示す図で、第１図は斜視図
、第２図は断面図、第３図乃至第１０図はこの考案の一
実施例を示す図で、第３図は斜視図、第４図は側面図、
第５図は要部の斜視図、第６−は要部の断面図、第７図
は斜視図、第８図は側面図、第９図は斜視図、第１０図
は側面図である。 第５図 第６図　−1 and 2 are views showing a conventional example, FIG. 1 is a perspective view, FIG. 2 is a sectional view, FIGS. 3 to 10 are views showing an embodiment of this invention, and FIG. The figure is a perspective view, Figure 4 is a side view,
FIG. 5 is a perspective view of the main part, FIG. 6 is a sectional view of the main part, FIG. 7 is a perspective view, FIG. 8 is a side view, FIG. 9 is a perspective view, and FIG. 10 is a side view. Figure 5 Figure 6 -

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 実装する半導体素子のワイヤーボンディング位置と電気
回路基板上のワイヤーボンディング位置とを略等しい高
さに形成して成ることを特徴とする半導体素子の実装構
造。A mounting structure for a semiconductor element, characterized in that a wire bonding position of a semiconductor element to be mounted and a wire bonding position on an electric circuit board are formed at substantially the same height.
JP1983065415U 1983-04-30 1983-04-30 Semiconductor element mounting structure Pending JPS59171350U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983065415U JPS59171350U (en) 1983-04-30 1983-04-30 Semiconductor element mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983065415U JPS59171350U (en) 1983-04-30 1983-04-30 Semiconductor element mounting structure

Publications (1)

Publication Number Publication Date
JPS59171350U true JPS59171350U (en) 1984-11-16

Family

ID=30195613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983065415U Pending JPS59171350U (en) 1983-04-30 1983-04-30 Semiconductor element mounting structure

Country Status (1)

Country Link
JP (1) JPS59171350U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020106617A (en) * 2018-12-26 2020-07-09 ネオフォトニクス・セミコンダクタ合同会社 Optical transmitter and inspection method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5396667A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5396667A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020106617A (en) * 2018-12-26 2020-07-09 ネオフォトニクス・セミコンダクタ合同会社 Optical transmitter and inspection method

Similar Documents

Publication Publication Date Title
JPS59171350U (en) Semiconductor element mounting structure
JPS6333665U (en)
JPS6083232U (en) chip parts
JPS60106375U (en) Mounting structure of external lead terminal
JPS60176568U (en) circuit board
JPS6057154U (en) flexible printed board
JPS6112244U (en) Mounting structure of packaged electronic components
JPS59151457U (en) semiconductor equipment
JPS6096805U (en) Transformer fixing device
JPS609226U (en) Package for semiconductor mounting
JPS6061742U (en) integrated circuit device
JPS6078141U (en) Electronic component mounting structure
JPS5929036U (en) LSI chip mounting structure
JPS60169849U (en) Integrated circuit mounting structure
JPS59127271U (en) Electronic component mounting board
JPS6078158U (en) hybrid integrated circuit board
JPS6080678U (en) Lead terminal for laminated board
JPS58175661U (en) Highly integrated hybrid integrated circuit
JPS6066003U (en) composite parts
JPS60174269U (en) Mounting structure of printed circuit board
JPS59177984U (en) Terminal fixing structure in electronic equipment
JPS59185849U (en) semiconductor equipment
JPS59107152U (en) Lead frame for semiconductor devices
JPS6127248U (en) lead frame
JPS60934U (en) integrated circuit device