JPS60169849U - Integrated circuit mounting structure - Google Patents
Integrated circuit mounting structureInfo
- Publication number
- JPS60169849U JPS60169849U JP5756784U JP5756784U JPS60169849U JP S60169849 U JPS60169849 U JP S60169849U JP 5756784 U JP5756784 U JP 5756784U JP 5756784 U JP5756784 U JP 5756784U JP S60169849 U JPS60169849 U JP S60169849U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- packaged integrated
- mounting structure
- circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案の実施例を示し、第1図は従来の実装構造
を示した斜視図、第2図は本考案を示した斜視図、第3
図は第2図で示した斜視図の断面図、第4図は他の実施
例を示した断面図である。
1a・・・回路基板、1b・・・回路基板、2a・・・
パッケージされた集積回路、2b・・・パッケージされ
た集積回路、3・・・リード線、4・・・ピン、8・・
・他の素子類。The drawings show an embodiment of the present invention, with Fig. 1 being a perspective view showing a conventional mounting structure, Fig. 2 being a perspective view showing the present invention, and Fig. 3 being a perspective view showing the conventional mounting structure.
This figure is a sectional view of the perspective view shown in FIG. 2, and FIG. 4 is a sectional view showing another embodiment. 1a...Circuit board, 1b...Circuit board, 2a...
Packaged integrated circuit, 2b... Packaged integrated circuit, 3... Lead wire, 4... Pin, 8...
・Other elements.
Claims (1)
および複数個の足を有する第2のパッケージされた集積
回路を前記第1および第2のパッケージされた集積回路
に電気的に接続する第1および第2の回路基板を備えた
集積回路の実装構造において、前記第1のパッケージさ
れた集積回路の1方側にある少なく、とも1個の足に電
気的接続かつ機械的に固定する第1の回路基板および前
記第1のパッケージされた集積回路の他側にある少なく
とも1個の足に電気的接続かつ機械的に固定する第2の
回路基板を設け、前記第2のパッケージされた集積回路
の1方側にある少なくとも1個の足に電気的接続かつ機
械的に固定する前記第1の回路基板および前記第2のパ
ッケージされた集積回路の他側にある少な(とも1個の
足に電気的接続かつ機械的に固定する前記第2の回路基
板を有する電気回路の超小型化を可能にしたことを特徴
とする実装構造。a first packaged integrated circuit having a plurality of legs;
and first and second circuit boards electrically connecting a second packaged integrated circuit having a plurality of legs to the first and second packaged integrated circuits. a first circuit board electrically connected to and mechanically secured to at least one foot on one side of the first packaged integrated circuit; a second circuit board electrically connected to and mechanically secured to at least one leg on the other side; electrically connecting and mechanically securing said first circuit board and said second circuit board on the other side of said second packaged integrated circuit; A mounting structure characterized by making it possible to miniaturize an electric circuit having a substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5756784U JPS60169849U (en) | 1984-04-19 | 1984-04-19 | Integrated circuit mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5756784U JPS60169849U (en) | 1984-04-19 | 1984-04-19 | Integrated circuit mounting structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60169849U true JPS60169849U (en) | 1985-11-11 |
Family
ID=30582218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5756784U Pending JPS60169849U (en) | 1984-04-19 | 1984-04-19 | Integrated circuit mounting structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60169849U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02137066U (en) * | 1989-04-14 | 1990-11-15 |
-
1984
- 1984-04-19 JP JP5756784U patent/JPS60169849U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02137066U (en) * | 1989-04-14 | 1990-11-15 |
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