JPS6061742U - integrated circuit device - Google Patents

integrated circuit device

Info

Publication number
JPS6061742U
JPS6061742U JP15289283U JP15289283U JPS6061742U JP S6061742 U JPS6061742 U JP S6061742U JP 15289283 U JP15289283 U JP 15289283U JP 15289283 U JP15289283 U JP 15289283U JP S6061742 U JPS6061742 U JP S6061742U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
terminals
abstract
flat package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15289283U
Other languages
Japanese (ja)
Inventor
土屋　俊紀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP15289283U priority Critical patent/JPS6061742U/en
Publication of JPS6061742U publication Critical patent/JPS6061742U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は標準的なりＩＰ型集積回路の斜視図、第２図は
従来のミニフラットパッケージ型集積回゛路装置の斜視
図、第３図は第２図の集積回路装置を配線基板に実装す
る状態を示す斜視図、第４図は従来のミニフラットパッ
ケージ型集積回路装置の他の例の斜視図、第５図ａ、　
ｂはそれぞれ本考案の一実施例の斜視図および側面図で
ある。 １．３・・・・・・パッケージ本体、２・・・・・・端
子、４゜４ａ、４ｂ・・・・・・ミニフラットパッケー
ジの端子、５・・・・・・マウントパッド、６ａ・・・
・・・外側に曲げた端子、６ｂ・・・・・・内側に曲げ
た端子。Figure 1 is a perspective view of a standard IP type integrated circuit, Figure 2 is a perspective view of a conventional mini flat package type integrated circuit device, and Figure 3 is the integrated circuit device shown in Figure 2 mounted on a wiring board. FIG. 4 is a perspective view of another example of the conventional mini-flat package integrated circuit device, and FIG. 5a,
b are a perspective view and a side view of an embodiment of the present invention, respectively. 1.3...Package body, 2...Terminals, 4゜4a, 4b...Mini flat package terminals, 5...Mount pad, 6a.・・・
...Terminal bent outward, 6b...Terminal bent inward.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 少なくとも４つ以上の端子をもつフラットパッケージ型
集積回路装置において、配線基板と接続のための端子が
、外側と内側に交互に曲げられていることを特徴とする
集積回路装置。1. A flat package integrated circuit device having at least four or more terminals, characterized in that terminals for connection to a wiring board are bent alternately outward and inward.
JP15289283U 1983-09-30 1983-09-30 integrated circuit device Pending JPS6061742U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15289283U JPS6061742U (en) 1983-09-30 1983-09-30 integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15289283U JPS6061742U (en) 1983-09-30 1983-09-30 integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6061742U true JPS6061742U (en) 1985-04-30

Family

ID=30338415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15289283U Pending JPS6061742U (en) 1983-09-30 1983-09-30 integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6061742U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03289162A (en) * 1990-04-05 1991-12-19 Rohm Co Ltd Surface-mount type electronic component
WO2025134696A1 (en) * 2023-12-20 2025-06-26 ローム株式会社 Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03289162A (en) * 1990-04-05 1991-12-19 Rohm Co Ltd Surface-mount type electronic component
WO2025134696A1 (en) * 2023-12-20 2025-06-26 ローム株式会社 Semiconductor device

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