JPH02131675U - - Google Patents
Info
- Publication number
- JPH02131675U JPH02131675U JP4077289U JP4077289U JPH02131675U JP H02131675 U JPH02131675 U JP H02131675U JP 4077289 U JP4077289 U JP 4077289U JP 4077289 U JP4077289 U JP 4077289U JP H02131675 U JPH02131675 U JP H02131675U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- magnetoresistive element
- chip
- hole
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 6
Landscapes
- Transmission And Conversion Of Sensor Element Output (AREA)
- Measuring Magnetic Variables (AREA)
Description
第１図ないし第３図は本考案の一実施例を示す
図であつて、第１図は磁気センサの斜視図、第２
図は同磁気センサの側面図、第３図は第１図の
−線に沿う断面図、第４図ないし第５図は従来
例として示した図であつて、第４図は磁気センサ
の斜視図、第５図は同磁気センサの側面図である
。
１１……基板、１１ａ……貫通孔、１２……磁
気抵抗素子、１３……チツプ、１５……回路接続
端子、１６……半田バンプ。
1 to 3 are views showing one embodiment of the present invention, in which FIG. 1 is a perspective view of a magnetic sensor, and FIG. 2 is a perspective view of a magnetic sensor.
Figure 3 is a side view of the magnetic sensor, Figure 3 is a sectional view taken along the - line in Figure 1, Figures 4 and 5 are views showing conventional examples, and Figure 4 is a perspective view of the magnetic sensor. FIG. 5 is a side view of the same magnetic sensor. 11... Board, 11a... Through hole, 12... Magnetoresistive element, 13... Chip, 15... Circuit connection terminal, 16... Solder bump.
Claims (1)
前記磁気抵抗素子から前記基板上の回路に配線が
施された磁気センサにおいて、前記基板には前記
チツプの磁気抵抗素子を有する部分が露出する大
きさの貫通孔が形成され、前記チツプはその磁気
抵抗素子を前記基板に対向させるとともに、前記
貫通孔から露出させて前記基板に固定されてなり
、前記磁気抵抗素子と基板上の回路とが半田によ
つて接続されていることを特徴とする磁気センサ
。 A chip having a magnetoresistive element is provided on a substrate,
In a magnetic sensor in which wiring is provided from the magnetoresistive element to a circuit on the substrate, a through hole is formed in the substrate to expose a portion of the chip having the magnetoresistive element, and the chip A magnetic device, characterized in that a resistive element is faced to the substrate, exposed through the through hole and fixed to the substrate, and the magnetoresistive element and a circuit on the substrate are connected by solder. sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4077289U JPH02131675U (en) | 1989-04-06 | 1989-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4077289U JPH02131675U (en) | 1989-04-06 | 1989-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02131675U true JPH02131675U (en) | 1990-11-01 |
Family
ID=31550850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4077289U Pending JPH02131675U (en) | 1989-04-06 | 1989-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02131675U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015111534A1 (en) * | 2014-01-22 | 2015-07-30 | アルプス電気株式会社 | Sensor module, and sensor chip and processing circuit chip used therein |
-
1989
- 1989-04-06 JP JP4077289U patent/JPH02131675U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015111534A1 (en) * | 2014-01-22 | 2015-07-30 | アルプス電気株式会社 | Sensor module, and sensor chip and processing circuit chip used therein |
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