JPH0235465U - - Google Patents
Info
- Publication number
- JPH0235465U JPH0235465U JP11377688U JP11377688U JPH0235465U JP H0235465 U JPH0235465 U JP H0235465U JP 11377688 U JP11377688 U JP 11377688U JP 11377688 U JP11377688 U JP 11377688U JP H0235465 U JPH0235465 U JP H0235465U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit board
- printed
- board
- seats
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案の一実施例を下側から見上げ
た斜視図である。第２図は、第１図の実施例を使
用配線されるべきプリント基板例を示す斜視図で
ある。第３図は、第１図の実施例を第２図のプリ
ント基板に塔載した状況を示す斜視図である。第
４図は、第１図の実施例を自動塔載機の塔載ヘツ
ドに吸着した状態を示す斜視図である。第５図は
、第１図の実施例の回路座と孔の一例を示す拡大
断面図である。第６図は、第２図のプリント基板
の回路座とその孔の一例を示す拡大断面図である
。第７図は、第５図の回路座と第６図の回路座を
はんだを介して接続した状況を示す拡大断面図で
ある。第８図は、従来のプリント基板の配線状況
例を示す斜視図である。
１……プリント基板（被塔載基板）、２，１２
……回路座、３，１３……孔、４……ストラツプ
線、５……プリント配線板（角形の絶縁基板）、
６，１４……プリント配線パターン、７ａ，７ｂ
……接着剤、８……はんだ、９……はんだ接触面
、１０……自動塔載機の塔載ヘツド。
FIG. 1 is a perspective view of an embodiment of the present invention viewed from below. FIG. 2 is a perspective view showing an example of a printed circuit board to be wired using the embodiment of FIG. 3 is a perspective view showing the embodiment of FIG. 1 mounted on the printed circuit board of FIG. 2. FIG. FIG. 4 is a perspective view showing the embodiment of FIG. 1 adsorbed on the tower head of an automatic tower machine. FIG. 5 is an enlarged sectional view showing an example of the circuit seat and hole of the embodiment of FIG. 1. FIG. 6 is an enlarged sectional view showing an example of the circuit seat and its hole of the printed circuit board of FIG. 2. FIG. FIG. 7 is an enlarged sectional view showing a state in which the circuit seat of FIG. 5 and the circuit seat of FIG. 6 are connected via solder. FIG. 8 is a perspective view showing an example of the wiring situation of a conventional printed circuit board. 1... Printed circuit board (mounted board), 2, 12
... Circuit seat, 3, 13 ... Hole, 4 ... Strap wire, 5 ... Printed wiring board (square insulating board),
6, 14...Printed wiring pattern, 7a, 7b
...Adhesive, 8...Solder, 9...Solder contact surface, 10...Tower head of automatic tower machine.
Claims (1)
、前記プリント基板の複数の回路座に対向する位
置に回路座を有し、前記回路座の一対がそれぞれ
プリント配線回路で接続された導電体パターンを
角形絶縁基板に形成したことを特徴とするチツプ
形プリント配線板。 When mounted on a printed circuit board to be wired, the circuit board has a circuit seat at a position opposite to a plurality of circuit seats on the printed circuit board, and each pair of the circuit seats each has a conductive pattern connected by a printed wiring circuit. A chip-shaped printed wiring board characterized by being formed on a square insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11377688U JPH0235465U (en) | 1988-08-30 | 1988-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11377688U JPH0235465U (en) | 1988-08-30 | 1988-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235465U true JPH0235465U (en) | 1990-03-07 |
Family
ID=31353915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11377688U Pending JPH0235465U (en) | 1988-08-30 | 1988-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235465U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006100566A (en) * | 2004-09-29 | 2006-04-13 | Toshiba Corp | Printed wiring board structure and electronic apparatus |
-
1988
- 1988-08-30 JP JP11377688U patent/JPH0235465U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006100566A (en) * | 2004-09-29 | 2006-04-13 | Toshiba Corp | Printed wiring board structure and electronic apparatus |