JPH0375501U - - Google Patents
Info
- Publication number
- JPH0375501U JPH0375501U JP13682189U JP13682189U JPH0375501U JP H0375501 U JPH0375501 U JP H0375501U JP 13682189 U JP13682189 U JP 13682189U JP 13682189 U JP13682189 U JP 13682189U JP H0375501 U JPH0375501 U JP H0375501U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- electrodes
- chip resistor
- low antibody
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
第１図は本考案の一実施例に係るチツプ抵抗を
プリント配線板に実装した状態を示す断面図、第
２図は従来一般のチツプ抵抗をプリント配線板に
実装した状態を示す断面図である。
１……チツプ抵抗、２……セラミツク基板（絶
縁基板）、２ａ，２ｂ……凹凸、３，４……電極
、５，６……ニツケルメツキ層、７，８……はん
だメツキ層、９……抵抗体、１０……オーバーコ
ート、１１……プリント配線板、１２，１３……
ランド。
FIG. 1 is a sectional view showing a chip resistor according to an embodiment of the present invention mounted on a printed wiring board, and FIG. 2 is a sectional view showing a conventional chip resistor mounted on a printed wiring board. . 1... Chip resistance, 2... Ceramic substrate (insulating substrate), 2a, 2b... Irregularities, 3, 4... Electrodes, 5, 6... Nickel plating layer, 7, 8... Solder plating layer, 9... Resistor, 10... Overcoat, 11... Printed wiring board, 12, 13...
land.
Claims (1)
された一対の電極と、これら両電極間を連結する
低抗体とを備え、プリント配線板に面実装される
チツプ抵抗において、上記絶縁基板の底面の両端
部を凹凸形状となして該凹凸部分に上記電極を設
け、該絶縁基板の底面の中央部に上記低抗体を設
けたことを特徴とするチツプ抵抗。 In a chip resistor that is surface-mounted on a printed wiring board, the surface of an approximately rectangular parallelepiped insulating substrate is provided with a pair of electrodes covered with a plating layer and a low antibody connecting these two electrodes, and the bottom surface of the insulating substrate is A chip resistor characterized in that both ends of the insulating substrate are formed into an uneven shape, the electrodes are provided on the uneven portions, and the low antibody is provided in the center of the bottom surface of the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13682189U JPH062241Y2 (en) | 1989-11-28 | 1989-11-28 | Chip resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13682189U JPH062241Y2 (en) | 1989-11-28 | 1989-11-28 | Chip resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0375501U true JPH0375501U (en) | 1991-07-29 |
| JPH062241Y2 JPH062241Y2 (en) | 1994-01-19 |
Family
ID=31684008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13682189U Expired - Lifetime JPH062241Y2 (en) | 1989-11-28 | 1989-11-28 | Chip resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH062241Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2011155241A1 (en) * | 2010-06-11 | 2013-08-01 | 株式会社村田製作所 | Electronic components |
-
1989
- 1989-11-28 JP JP13682189U patent/JPH062241Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2011155241A1 (en) * | 2010-06-11 | 2013-08-01 | 株式会社村田製作所 | Electronic components |
| JP5459400B2 (en) * | 2010-06-11 | 2014-04-02 | 株式会社村田製作所 | Electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH062241Y2 (en) | 1994-01-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |