JPS6039272U - thick film circuit board - Google Patents

thick film circuit board

Info

Publication number
JPS6039272U
JPS6039272U JP13162383U JP13162383U JPS6039272U JP S6039272 U JPS6039272 U JP S6039272U JP 13162383 U JP13162383 U JP 13162383U JP 13162383 U JP13162383 U JP 13162383U JP S6039272 U JPS6039272 U JP S6039272U
Authority
JP
Japan
Prior art keywords
circuit board
thick film
film circuit
groove
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13162383U
Other languages
Japanese (ja)
Inventor
岡村　文男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Priority to JP13162383U priority Critical patent/JPS6039272U/en
Publication of JPS6039272U publication Critical patent/JPS6039272U/en
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ、　ｂ、　ｃは従来の厚膜回路基板の製造過程
を示す各側断面図、第２図ａ、　ｂ、　ｃはこの考案に
なる厚膜回路基板の実施例を示す製造過程の各側断面図
である。 ５・・・誘電体基板、６，６′・・・凹溝、７，８・・
・導体パターン、９・・・抵抗体。Figures 1a, b, and c are side sectional views showing the manufacturing process of a conventional thick film circuit board, and Figures 2a, b, and c are sectional views of the manufacturing process showing an embodiment of the thick film circuit board according to the invention. It is each side sectional view. 5... Dielectric substrate, 6, 6'... Concave groove, 7, 8...
・Conductor pattern, 9...Resistor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 誘電体基板上に、予め導体パターンと同形状の凹溝を形
成して、この凹溝内に導体パターンを充填形成させ、さ
らに、その上面に抵抗体を形成させたことを特徴とする
厚膜回路基板。A thick film characterized in that a groove having the same shape as a conductor pattern is formed in advance on a dielectric substrate, a conductor pattern is filled in the groove, and a resistor is further formed on the upper surface of the groove. circuit board.
JP13162383U 1983-08-25 1983-08-25 thick film circuit board Pending JPS6039272U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13162383U JPS6039272U (en) 1983-08-25 1983-08-25 thick film circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13162383U JPS6039272U (en) 1983-08-25 1983-08-25 thick film circuit board

Publications (1)

Publication Number Publication Date
JPS6039272U true JPS6039272U (en) 1985-03-19

Family

ID=30297508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13162383U Pending JPS6039272U (en) 1983-08-25 1983-08-25 thick film circuit board

Country Status (1)

Country Link
JP (1) JPS6039272U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01173778A (en) * 1987-12-28 1989-07-10 Ibiden Co Ltd Manufacture of printed wiring board with resistor
JPH0211374U (en) * 1988-07-05 1990-01-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01173778A (en) * 1987-12-28 1989-07-10 Ibiden Co Ltd Manufacture of printed wiring board with resistor
JPH0211374U (en) * 1988-07-05 1990-01-24

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