JPH01145168U - - Google Patents
Info
- Publication number
- JPH01145168U JPH01145168U JP4079288U JP4079288U JPH01145168U JP H01145168 U JPH01145168 U JP H01145168U JP 4079288 U JP4079288 U JP 4079288U JP 4079288 U JP4079288 U JP 4079288U JP H01145168 U JPH01145168 U JP H01145168U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- substrate
- pattern
- base substrate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 6
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案の平面斜視図、第２図は本考
案の断面図、第３図は、従来例の平面斜視図、第
４図は従来例の断面図である。
１……ＦＰＣ基板、２……露出パターン、３…
…接合パターン、４……側面端部、５……ガラエ
ポ基板、６……接合パターン、７……半田付部分
、８……接合基板端部、９……接合パターン。
FIG. 1 is a perspective plan view of the present invention, FIG. 2 is a sectional view of the invention, FIG. 3 is a perspective plan view of a conventional example, and FIG. 4 is a sectional view of the conventional example. 1...FPC board, 2...Exposed pattern, 3...
... bonding pattern, 4... side edge, 5... glass epoxy board, 6... bonding pattern, 7... soldering part, 8... bonding board end, 9... bonding pattern.
Claims (1)
の接合パターンが巾広に配設されているベース基
板と、前記ベース基板上面に配設され、前記接合
パターン上面に対抗して配設される露出パターン
が配設されている接合基板とで構成され、接続部
分が、前記接合基板の側面端部を含んで接合され
ている事を特徴とする基板の接合構造。 In a connection structure for a board of a small electronic device, a base substrate has a wide bonding pattern at both ends, and an exposed pattern is provided on the upper surface of the base substrate and is arranged opposite to the upper surface of the bonding pattern. What is claimed is: 1. A bonding structure for substrates comprising a bonding substrate on which a bonding substrate is disposed, and a connecting portion is bonded including a side edge of the bonding substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4079288U JPH01145168U (en) | 1988-03-28 | 1988-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4079288U JPH01145168U (en) | 1988-03-28 | 1988-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145168U true JPH01145168U (en) | 1989-10-05 |
Family
ID=31267254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4079288U Pending JPH01145168U (en) | 1988-03-28 | 1988-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145168U (en) |
-
1988
- 1988-03-28 JP JP4079288U patent/JPH01145168U/ja active Pending