JPH0336166U - - Google Patents
Info
- Publication number
- JPH0336166U JPH0336166U JP9604289U JP9604289U JPH0336166U JP H0336166 U JPH0336166 U JP H0336166U JP 9604289 U JP9604289 U JP 9604289U JP 9604289 U JP9604289 U JP 9604289U JP H0336166 U JPH0336166 U JP H0336166U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- connection pads
- electrodes
- mount component
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Description
第１図は本考案の第１の実施例を示す側断面図
、第２図は第２の実施例を示す側断面図、第３図
は従来例を示す側断面図である。
１……面実装部品、２……電極、３……基板、
４……接続パツド、５……導電性樹脂、６……基
板、７……凹部、８……面実装部品、９……凹部
。
FIG. 1 is a side sectional view showing a first embodiment of the present invention, FIG. 2 is a side sectional view showing the second embodiment, and FIG. 3 is a side sectional view showing a conventional example. 1...Surface mount component, 2...Electrode, 3...Substrate,
4... Connection pad, 5... Conductive resin, 6... Board, 7... Recess, 8... Surface mount component, 9... Recess.
Claims (1)
電極にそれぞれ対応して設けられた接続パツドを
有する基板とを、導電性接着材を介して実装する
面実装部品の実装構造において、 前記基板の接続パツドと同一面でその接続パツ
ド間、もしくは面実装部品の底面側で両端部の電
極間の少なくとも一方に凹部を設けることを特徴
とする面実装部品の実装構造。[Claims for Utility Model Registration] A surface mount device in which a surface mount component having electrodes formed at both ends and a substrate having connection pads provided corresponding to the electrodes are mounted via a conductive adhesive. In the mounting structure of the surface mount component, a recess is provided on the same surface as the connection pads of the board and between the connection pads, or at least one of the electrodes at both ends on the bottom side of the surface mount component. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9604289U JPH0336166U (en) | 1989-08-18 | 1989-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9604289U JPH0336166U (en) | 1989-08-18 | 1989-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336166U true JPH0336166U (en) | 1991-04-09 |
Family
ID=31645269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9604289U Pending JPH0336166U (en) | 1989-08-18 | 1989-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336166U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011129696A (en) * | 2009-12-17 | 2011-06-30 | Koa Corp | Mounting structure for electronic component |
-
1989
- 1989-08-18 JP JP9604289U patent/JPH0336166U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011129696A (en) * | 2009-12-17 | 2011-06-30 | Koa Corp | Mounting structure for electronic component |