JPS63132475U - - Google Patents
Info
- Publication number
- JPS63132475U JPS63132475U JP2285387U JP2285387U JPS63132475U JP S63132475 U JPS63132475 U JP S63132475U JP 2285387 U JP2285387 U JP 2285387U JP 2285387 U JP2285387 U JP 2285387U JP S63132475 U JPS63132475 U JP S63132475U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electronic component
- base film
- adhesive
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例に係るチツプ電子部
品の取付構造を示す要部断面図、第２図はその平
面図、第３図は従来例の要部断面図である。
１……ベースフイルム、３……支持板、４……
導電パターン、４ａ……ランド部、５……チツプ
電子部品、６……電極、１０……導電性接着剤。
FIG. 1 is a sectional view of a main part showing a mounting structure for a chip electronic component according to an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a sectional view of a main part of a conventional example. 1...Base film, 3...Support plate, 4...
Conductive pattern, 4a... Land portion, 5... Chip electronic component, 6... Electrode, 10... Conductive adhesive.
Claims (1)
硬質材料からなる支持板上に固着し、該導電パタ
ーンのランド部にチツプ電子部品の電極を導電性
接着剤を介して接続するものにおいて、硬化性の
導電性接着剤を前記ランドから前記ベースフイル
ム上に延出するように塗布し、この延出部分の導
電性接着剤に前記チツプ部品の電極を固着したこ
とを特徴とするチツプ電子部品の取付構造。 A base film having a conductive pattern on its surface is fixed on a support plate made of a hard material, and an electrode of a chip electronic component is connected to the land portion of the conductive pattern via a conductive adhesive. A mounting structure for a chip electronic component, characterized in that an adhesive is applied so as to extend from the land onto the base film, and an electrode of the chip component is fixed to the conductive adhesive in this extended portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2285387U JPS63132475U (en) | 1987-02-20 | 1987-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2285387U JPS63132475U (en) | 1987-02-20 | 1987-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63132475U true JPS63132475U (en) | 1988-08-30 |
Family
ID=30820630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2285387U Pending JPS63132475U (en) | 1987-02-20 | 1987-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63132475U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020195103A1 (en) * | 2019-03-27 | 2020-10-01 | 株式会社オートネットワーク技術研究所 | Circuit board and method of manufacturing electric junction box including circuit board |
-
1987
- 1987-02-20 JP JP2285387U patent/JPS63132475U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020195103A1 (en) * | 2019-03-27 | 2020-10-01 | 株式会社オートネットワーク技術研究所 | Circuit board and method of manufacturing electric junction box including circuit board |