JPS63157974U - - Google Patents

Info

Publication number
JPS63157974U
JPS63157974U JP5021787U JP5021787U JPS63157974U JP S63157974 U JPS63157974 U JP S63157974U JP 5021787 U JP5021787 U JP 5021787U JP 5021787 U JP5021787 U JP 5021787U JP S63157974 U JPS63157974 U JP S63157974U
Authority
JP
Japan
Prior art keywords
pad portion
mounting
chip carrier
electronic component
leadless chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5021787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5021787U priority Critical patent/JPS63157974U/ja
Publication of JPS63157974U publication Critical patent/JPS63157974U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案の第1の実施例及び
第2の実施例を示す。第3図は従来のリードレス
チツプキヤリア型電子部品の搭載用パツド部を有
する印刷配線板の搭載用パツド部のパターンを示
す。 1,11……リードレスチツプキヤリア型電子
部品、2,12……搭載用パツド、3……粘着性
の導電性物質、4,14……リードレスチツプキ
ヤリア接続部、10,40……基板。
1 and 2 show a first embodiment and a second embodiment of the present invention. FIG. 3 shows a pattern of a mounting pad portion of a printed wiring board having a conventional leadless chip carrier type electronic component mounting pad portion. 1, 11... Leadless chip carrier electronic component, 2, 12... Mounting pad, 3... Adhesive conductive material, 4, 14... Leadless chip carrier connection part, 10, 40... Board .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードレスチツプキヤリア型電子部品の搭載用
パツド部を有する印刷配線板において、前記搭載
用パツド部のパターン表面に粘着性のある導電性
物質を塗本したことを特徴する印刷配線板。
1. A printed wiring board having a pad portion for mounting a leadless chip carrier type electronic component, characterized in that a pattern surface of the pad portion for mounting is coated with an adhesive conductive substance.
JP5021787U 1987-04-01 1987-04-01 Pending JPS63157974U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5021787U JPS63157974U (en) 1987-04-01 1987-04-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5021787U JPS63157974U (en) 1987-04-01 1987-04-01

Publications (1)

Publication Number Publication Date
JPS63157974U true JPS63157974U (en) 1988-10-17

Family

ID=30873372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5021787U Pending JPS63157974U (en) 1987-04-01 1987-04-01

Country Status (1)

Country Link
JP (1) JPS63157974U (en)

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