JPH0195782U - - Google Patents
Info
- Publication number
- JPH0195782U JPH0195782U JP19256887U JP19256887U JPH0195782U JP H0195782 U JPH0195782 U JP H0195782U JP 19256887 U JP19256887 U JP 19256887U JP 19256887 U JP19256887 U JP 19256887U JP H0195782 U JPH0195782 U JP H0195782U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- wiring board
- printed wiring
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案に係るプリント配線板の一実施
例を示す縦断面図、第２図は第１図のパツドのパ
ターン例を示す平面図である。
１……基板、２……パツド、３……絶縁被膜、
４……接着剤層、５……プリント配線板。
FIG. 1 is a longitudinal sectional view showing an embodiment of a printed wiring board according to the present invention, and FIG. 2 is a plan view showing an example of the pattern of the pad shown in FIG. 1...Substrate, 2...Pad, 3...Insulating coating,
4...Adhesive layer, 5...Printed wiring board.
Claims (1)
電性薄膜よりなる部品実装用パツドと、このパツ
ドの表面の少くとも一部を残して前記基板の表面
を被覆する絶縁被膜とをそれぞれ形成するととも
に、前記基板の裏面に接着剤層を形成したことを
特徴とするプリント配線板。 Forming a component mounting pad made of a conductive thin film in an arbitrary pattern on the surface of a film-like substrate, and an insulating coating covering the surface of the substrate while leaving at least a part of the surface of the pad, respectively; A printed wiring board characterized in that an adhesive layer is formed on the back surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19256887U JPH0195782U (en) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19256887U JPH0195782U (en) | 1987-12-18 | 1987-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195782U true JPH0195782U (en) | 1989-06-26 |
Family
ID=31483418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19256887U Pending JPH0195782U (en) | 1987-12-18 | 1987-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195782U (en) |
-
1987
- 1987-12-18 JP JP19256887U patent/JPH0195782U/ja active Pending