JPH01113926U - - Google Patents
Info
- Publication number
- JPH01113926U JPH01113926U JP814188U JP814188U JPH01113926U JP H01113926 U JPH01113926 U JP H01113926U JP 814188 U JP814188 U JP 814188U JP 814188 U JP814188 U JP 814188U JP H01113926 U JPH01113926 U JP H01113926U
- Authority
- JP
- Japan
- Prior art keywords
- wiring material
- copper wiring
- spraying
- coating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000009740 moulding (composite fabrication) Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Description
第１図はこの考案の一実施例の側断面図、第２
図は従来の印刷配線基板の平面図、第３図は第２
図のものの側断面図である。
１……基板、３……銅配線材、４……超電導材
。なお、各図中、同一符号は同一又は相当部分を
示す。
Figure 1 is a side sectional view of one embodiment of this invention;
The figure is a plan view of a conventional printed wiring board, and Figure 3 is a plan view of a conventional printed wiring board.
FIG. 1...Substrate, 3...Copper wiring material, 4...Superconducting material. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
付けおよび薄模形成のいずれかにより形成された
超電導材とからなる配線基板用配線材。 A wiring material for a wiring board comprising a copper wiring material and a superconducting material formed on the outer surface of the copper wiring material by coating, spraying, or forming a thin pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP814188U JPH01113926U (en) | 1988-01-27 | 1988-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP814188U JPH01113926U (en) | 1988-01-27 | 1988-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113926U true JPH01113926U (en) | 1989-07-31 |
Family
ID=31213755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP814188U Pending JPH01113926U (en) | 1988-01-27 | 1988-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113926U (en) |
-
1988
- 1988-01-27 JP JP814188U patent/JPH01113926U/ja active Pending