JPH0426569U - - Google Patents
Info
- Publication number
- JPH0426569U JPH0426569U JP5057290U JP5057290U JPH0426569U JP H0426569 U JPH0426569 U JP H0426569U JP 5057290 U JP5057290 U JP 5057290U JP 5057290 U JP5057290 U JP 5057290U JP H0426569 U JPH0426569 U JP H0426569U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- wiring board
- printed wiring
- board body
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す側断面図、第
２図は印刷配線板本体上に回路パターンを固着し
た状態を示す平面図、第３図は絶縁物の形状を示
す平面図、第４図は従来例を示す側断面図である
。
１……印刷配線板、２……印刷配線板本体、３
……回路パターン、４……絶縁被膜、６……絶縁
物、７……切り欠き部。
FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is a plan view showing a state in which a circuit pattern is fixed on a printed wiring board body, and FIG. 3 is a plan view showing the shape of an insulator. FIG. 4 is a side sectional view showing a conventional example. 1...Printed wiring board, 2...Printed wiring board main body, 3
...Circuit pattern, 4...Insulating coating, 6...Insulator, 7...Notch portion.
Claims (1)
、絶縁被膜とを有し、 前記回路パターンは、前記印刷配線板本体の表
面に固着し、 また、前記絶縁物は、前記回路パターンとほぼ
同じ厚さで、かつ、前記回路パターン部分を切り
欠いた板状に構成するとともに、この切り欠き部
に前記回路パターンを入れ込んで印刷配線板本体
の表面に固着し、 さらに、前記絶縁被膜は、前記回路パターンと
絶縁物の表面に固着している ことを特徴とする印刷配線板。[Claims for Utility Model Registration] A printed wiring board body, a circuit pattern, an insulating material, and an insulating coating, the circuit pattern being fixed to the surface of the printed wiring board body, and the insulating material The circuit pattern is approximately the same thickness as the circuit pattern, and is formed into a plate shape with the circuit pattern portion cut out, and the circuit pattern is inserted into the cutout portion and fixed to the surface of the printed wiring board body. . The printed wiring board further characterized in that the insulating film is adhered to the circuit pattern and the surface of the insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5057290U JPH0426569U (en) | 1990-05-14 | 1990-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5057290U JPH0426569U (en) | 1990-05-14 | 1990-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426569U true JPH0426569U (en) | 1992-03-03 |
Family
ID=31569232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5057290U Pending JPH0426569U (en) | 1990-05-14 | 1990-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426569U (en) |
-
1990
- 1990-05-14 JP JP5057290U patent/JPH0426569U/ja active Pending