JPH044775U - - Google Patents
Info
- Publication number
- JPH044775U JPH044775U JP4354790U JP4354790U JPH044775U JP H044775 U JPH044775 U JP H044775U JP 4354790 U JP4354790 U JP 4354790U JP 4354790 U JP4354790 U JP 4354790U JP H044775 U JPH044775 U JP H044775U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- foil pattern
- copper foil
- copper plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図乃至第３図はこの考案に係るプリント基
板の構造の実施例を示し、第１図は銅箔パターン
面の斜視図、第２図は断面図、第３図は他の実施
例の断面図である。第４図は従来例を示した斜視
図である。
主な符号の説明、１……絶縁体で形成したプリ
ント基板、２……低インピーダンスが要求される
第１の銅箔パターン、３……従来構造の第２の銅
箔パターン、４……第１の銅箔パターン上に固定
した銅板、５……プリント基板１に取り付けられ
た電圧部品、６……第１の銅箔パターン上に固定
したジヤンパー銅板。
1 to 3 show examples of the structure of the printed circuit board according to this invention, FIG. 1 is a perspective view of the copper foil pattern surface, FIG. 2 is a sectional view, and FIG. 3 is a diagram of another example. FIG. FIG. 4 is a perspective view showing a conventional example. Explanation of main symbols: 1...Printed circuit board formed of an insulator, 2...First copper foil pattern requiring low impedance, 3...Second copper foil pattern with conventional structure, 4...First copper foil pattern Copper plate fixed on the copper foil pattern 1, 5...voltage component attached to the printed circuit board 1, 6... jumper copper plate fixed on the first copper foil pattern.
Claims (1)
上の銅箔パターンの面積を大きくして形成したプ
リント基板の構造において、 プリント基板上の銅箔パターンに合わせて形成
した銅板を設け、この銅板をプリント基板上の銅
箔パターン面に固定したことを特徴とするプリン
ト基板の構造。 ２ 上記銅板がジヤンパー形状のジヤンパー銅板
で構成したことを特徴とする請求項１記載のプリ
ント基板の構造。[Scope of Claim for Utility Model Registration] 1. In the structure of a printed circuit board formed by increasing the area of the copper foil pattern on the printed circuit board that requires low impedance, a copper plate formed to match the copper foil pattern on the printed circuit board is A structure of a printed circuit board, characterized in that the copper plate is fixed to a copper foil pattern surface on a printed circuit board. 2. The printed circuit board structure according to claim 1, wherein the copper plate is a jumper copper plate having a jumper shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4354790U JPH044775U (en) | 1990-04-25 | 1990-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4354790U JPH044775U (en) | 1990-04-25 | 1990-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044775U true JPH044775U (en) | 1992-01-16 |
Family
ID=31556051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4354790U Pending JPH044775U (en) | 1990-04-25 | 1990-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044775U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017045917A (en) * | 2015-08-28 | 2017-03-02 | 京セラ株式会社 | Electronic apparatus and substrate |
-
1990
- 1990-04-25 JP JP4354790U patent/JPH044775U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017045917A (en) * | 2015-08-28 | 2017-03-02 | 京セラ株式会社 | Electronic apparatus and substrate |