JPH0482878U - - Google Patents
Info
- Publication number
- JPH0482878U JPH0482878U JP12750490U JP12750490U JPH0482878U JP H0482878 U JPH0482878 U JP H0482878U JP 12750490 U JP12750490 U JP 12750490U JP 12750490 U JP12750490 U JP 12750490U JP H0482878 U JPH0482878 U JP H0482878U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- pattern
- foil patterns
- patterns
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図及び第２図はこの考案に係るプリント基
板のパターン構造の実施例を示し、第１図ａは銅
箔パターンを示す図、第１図ｂは銅箔パターンを
半田で接続した状態を示す図、第１図ｃはランド
の形状を変化させた状態を示す図、第２図は他の
実施例を示す図である。第３図は従来の銅箔パタ
ーンの実施例を示す図である。
主な符号の説明、１，２……ランド、１ａ，２
ａ……銅箔パターン、３……スリツト。
1 and 2 show an example of the pattern structure of a printed circuit board according to this invention, FIG. 1a shows a copper foil pattern, and FIG. 1b shows a state in which the copper foil patterns are connected by solder. FIG. 1c is a diagram showing a state in which the shape of the land is changed, and FIG. 2 is a diagram showing another embodiment. FIG. 3 is a diagram showing an example of a conventional copper foil pattern. Explanation of main symbols, 1, 2...Land, 1a, 2
a...Copper foil pattern, 3...Slit.
Claims (1)
ンを形成すると共に前記銅箔パターンを対向せし
め、対向する２つの銅箔パターン間に絶縁用のス
リツトを設けたことを特徴とするプリント基板の
パターン構造。 A pattern structure of a printed circuit board, characterized in that a copper foil pattern is formed on each of at least two lands, the copper foil patterns are opposed to each other, and an insulating slit is provided between the two opposing copper foil patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12750490U JPH0482878U (en) | 1990-11-28 | 1990-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12750490U JPH0482878U (en) | 1990-11-28 | 1990-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0482878U true JPH0482878U (en) | 1992-07-20 |
Family
ID=31874999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12750490U Pending JPH0482878U (en) | 1990-11-28 | 1990-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0482878U (en) |
-
1990
- 1990-11-28 JP JP12750490U patent/JPH0482878U/ja active Pending