JPH0420260U - - Google Patents
Info
- Publication number
- JPH0420260U JPH0420260U JP6263990U JP6263990U JPH0420260U JP H0420260 U JPH0420260 U JP H0420260U JP 6263990 U JP6263990 U JP 6263990U JP 6263990 U JP6263990 U JP 6263990U JP H0420260 U JPH0420260 U JP H0420260U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder land
- insertion hole
- hole
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例に係るプリント基板
の平面図、第２図は同断面図、第３図は従来例に
係るプリント基板の平面図、第４図は同断面図で
ある。
１……基板、２……部品挿入孔、３……はんだ
ランド、３ａ……銅箔、４……スルーホール、６
……リード、７……はんだ。
FIG. 1 is a plan view of a printed circuit board according to an embodiment of the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is a plan view of a conventional printed circuit board, and FIG. 4 is a sectional view thereof. 1... Board, 2... Component insertion hole, 3... Solder land, 3a... Copper foil, 4... Through hole, 6
...Lead, 7...Solder.
Claims (1)
だランドを形成し、このはんだランドの中心に部
分挿入孔を設け、前記はんだランドの内部に前記
部品挿入孔を囲むように複数のスルーホールを設
けると共に該スルーホール内をはんだの充填部と
して構成したことを特徴とするプリント基板。 A solder land for lead connection is formed on the surface of the board using conductive foil, a partial insertion hole is provided in the center of the solder land, and a plurality of through holes are provided inside the solder land so as to surround the component insertion hole. A printed circuit board characterized in that the inside of the through hole is configured as a solder filling part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6263990U JPH0420260U (en) | 1990-06-12 | 1990-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6263990U JPH0420260U (en) | 1990-06-12 | 1990-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420260U true JPH0420260U (en) | 1992-02-20 |
Family
ID=31591973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6263990U Pending JPH0420260U (en) | 1990-06-12 | 1990-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420260U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393195A (en) * | 1986-10-08 | 1988-04-23 | 松下電器産業株式会社 | Attaching apparatus of electronic component |
| JPH0213773B2 (en) * | 1981-05-21 | 1990-04-05 | Olympus Optical Co |
-
1990
- 1990-06-12 JP JP6263990U patent/JPH0420260U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0213773B2 (en) * | 1981-05-21 | 1990-04-05 | Olympus Optical Co | |
| JPS6393195A (en) * | 1986-10-08 | 1988-04-23 | 松下電器産業株式会社 | Attaching apparatus of electronic component |