JPS6316479U - - Google Patents
Info
- Publication number
- JPS6316479U JPS6316479U JP10942786U JP10942786U JPS6316479U JP S6316479 U JPS6316479 U JP S6316479U JP 10942786 U JP10942786 U JP 10942786U JP 10942786 U JP10942786 U JP 10942786U JP S6316479 U JPS6316479 U JP S6316479U
- Authority
- JP
- Japan
- Prior art keywords
- land
- wiring board
- printed wiring
- dip
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は印刷配線板の一部を示す平面図、第２
図は電子部品を載置した状態の印刷配線板の一部
を示す平面図、第３図ａ、第３図ｂ、第３図ｃ、
第３図ｄはデイツプ半田付け作業工程を説明する
ための正面図である。
１…印刷配線板、２…ランド、３…スルーホー
ルランド、４…電子部品、６…接続端子、７…デ
イツプ半田。
Figure 1 is a plan view showing a part of the printed wiring board;
The figures are plan views showing a part of the printed wiring board with electronic components placed on it, Figure 3a, Figure 3b, Figure 3c,
FIG. 3d is a front view for explaining the dip soldering process. 1...Printed wiring board, 2...Land, 3...Through hole land, 4...Electronic component, 6...Connection terminal, 7...Dip solder.
Claims (1)
ツプ半田するランドと、このランドの隣りに間隔
をおいて形成するスルーホールランドとを設けた
ことを特徴とする電子部品搭載用印刷配線板。 A printed wiring board for mounting electronic components, characterized in that a land is provided for dip-soldering a plurality of connection terminals provided on an electronic component, and a through-hole land is formed at intervals next to the land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10942786U JPS6316479U (en) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10942786U JPS6316479U (en) | 1986-07-18 | 1986-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316479U true JPS6316479U (en) | 1988-02-03 |
Family
ID=30987515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10942786U Pending JPS6316479U (en) | 1986-07-18 | 1986-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316479U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303068A (en) * | 2005-04-19 | 2006-11-02 | Mitsubishi Electric Corp | Printed circuit board and manufacturing method thereof |
-
1986
- 1986-07-18 JP JP10942786U patent/JPS6316479U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303068A (en) * | 2005-04-19 | 2006-11-02 | Mitsubishi Electric Corp | Printed circuit board and manufacturing method thereof |
| JP4545629B2 (en) * | 2005-04-19 | 2010-09-15 | 三菱電機株式会社 | Printed circuit board |