JPS63195778U - - Google Patents
Info
- Publication number
- JPS63195778U JPS63195778U JP8712487U JP8712487U JPS63195778U JP S63195778 U JPS63195778 U JP S63195778U JP 8712487 U JP8712487 U JP 8712487U JP 8712487 U JP8712487 U JP 8712487U JP S63195778 U JPS63195778 U JP S63195778U
- Authority
- JP
- Japan
- Prior art keywords
- circuit components
- printed wiring
- wiring board
- flat package
- dip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案のプリント配線板の断面図、第
２図は本考案の一実施例の半田付け方法を説明す
るための図、第３図は従来のプリント配線板の断
面図である。
図において、１はプリント配線板、２はスルホ
ール、３はデイツプタイプの集積回路（ＤＩＰ）
、４は配線ランド、５は半田、６はスルホール導
体、７はフラツトパツケージタイプの集積回路（
ＳＭＤ）、８は半田槽を示している。
FIG. 1 is a cross-sectional view of a printed wiring board of the present invention, FIG. 2 is a diagram for explaining a soldering method according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional printed wiring board. In the figure, 1 is a printed wiring board, 2 is a through hole, and 3 is a dip type integrated circuit (DIP).
, 4 is a wiring land, 5 is solder, 6 is a through-hole conductor, and 7 is a flat package type integrated circuit (
SMD), 8 indicates a solder tank.
Claims (1)
７の回路部品を混在して実装するプリント配線板
において、 前記デイツプタイプの回路部品を一方の面Ａに
実装し、他の一方の面Ｂに前記フラツトパツケー
ジタイプの回路部品を実装する構造としたことを
特徴とするプリント配線板。[Claims for Utility Model Registration] In a printed wiring board on which dip type 3 and flat package type 7 circuit components are mounted together, the dip type circuit components are mounted on one side A and the other side B. A printed wiring board characterized in that it has a structure in which the flat package type circuit components are mounted on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8712487U JPS63195778U (en) | 1987-06-03 | 1987-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8712487U JPS63195778U (en) | 1987-06-03 | 1987-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195778U true JPS63195778U (en) | 1988-12-16 |
Family
ID=30944060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8712487U Pending JPS63195778U (en) | 1987-06-03 | 1987-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195778U (en) |
-
1987
- 1987-06-03 JP JP8712487U patent/JPS63195778U/ja active Pending
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