JPH01121968U - - Google Patents
Info
- Publication number
- JPH01121968U JPH01121968U JP1661188U JP1661188U JPH01121968U JP H01121968 U JPH01121968 U JP H01121968U JP 1661188 U JP1661188 U JP 1661188U JP 1661188 U JP1661188 U JP 1661188U JP H01121968 U JPH01121968 U JP H01121968U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- printed
- board
- circuit package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002787 reinforcement Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
第１図は本考案の一実施例に係る電子回路パツ
ケージの半田ＤＩＰ前の状態を示す縦断面図、第
２図は第１図のサブプリント基板を示す拡大縦断
面図、第３図は第２図の平面図である。
１……電子部品、２……プリント基板、３……
スルーホール、４……サブプリント基板、５……
リード端子、１０……グランド接続穴部。
1 is a vertical cross-sectional view showing an electronic circuit package according to an embodiment of the present invention in a state before soldering DIP, FIG. 2 is an enlarged vertical cross-sectional view showing the sub-printed circuit board of FIG. 1, and FIG. FIG. 2 is a plan view of FIG. 1...Electronic components, 2...Printed circuit boards, 3...
Through hole, 4...Sub printed circuit board, 5...
Lead terminal, 10...Ground connection hole.
Claims (1)
のスルーホールに挿入・接続した電子回路パツケ
ージにおいて、 上記プリント基板の半田面側にグランド強化用
のサブプリント基板を設けることを特徴とする電
子回路パツケージ。[Scope of claim for utility model registration] In an electronic circuit package in which lead terminals of multiple electronic components are inserted and connected to through holes of a printed circuit board, a sub-printed board for ground reinforcement is provided on the solder side of the printed circuit board. An electronic circuit package featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1661188U JPH01121968U (en) | 1988-02-10 | 1988-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1661188U JPH01121968U (en) | 1988-02-10 | 1988-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01121968U true JPH01121968U (en) | 1989-08-18 |
Family
ID=31229695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1661188U Pending JPH01121968U (en) | 1988-02-10 | 1988-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01121968U (en) |
-
1988
- 1988-02-10 JP JP1661188U patent/JPH01121968U/ja active Pending
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