JPS6424877U - - Google Patents
Info
- Publication number
- JPS6424877U JPS6424877U JP11920587U JP11920587U JPS6424877U JP S6424877 U JPS6424877 U JP S6424877U JP 11920587 U JP11920587 U JP 11920587U JP 11920587 U JP11920587 U JP 11920587U JP S6424877 U JPS6424877 U JP S6424877U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- parts
- type parts
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案による実施例を示し、第１図
イはプリント配線基板に形成した取付孔に小型部
品をつきさすように取付けた状態を示す断面図、
第１図ロはプリント配線基板に形成した取付孔に
小型部品を取付けた状態を示す他の実施例の断面
図、第１図ハは２枚のプリント配線基板に形成し
た取付孔を貫通して小型部品を取付けた状態を示
す断面図、第２図イおよびロは従来のプリント配
線基板を示す断面図である。
主な図番の説明、１，１Ａ：プリント配線基板
、２：基板、３，４：銅箔パターン、３ａ，４ａ
：回路、５：取付孔、６：チツプ型部品、７，８
：電極部、９，１０：半田。
FIG. 1 shows an embodiment of this invention, and FIG. 1A is a cross-sectional view showing a state in which a small component is inserted into a mounting hole formed on a printed wiring board.
Figure 1 (b) is a cross-sectional view of another embodiment showing a state in which small parts are mounted in mounting holes formed on a printed wiring board, and Figure 1 (c) is a cross-sectional view of another embodiment showing a state in which small parts are attached to mounting holes formed in two printed wiring boards. FIG. 2A and FIG. 2B are cross-sectional views showing a conventional printed wiring board. Explanation of main drawing numbers, 1, 1A: Printed wiring board, 2: Board, 3, 4: Copper foil pattern, 3a, 4a
: Circuit, 5: Mounting hole, 6: Chip type part, 7, 8
: Electrode part, 9, 10: Solder.
Claims (1)
実装するプリント配線基板において、 このプリント配線基板に前記チツプ型部品又は
メルフ型部品等の小型部品を組み付けるための取
付孔を形成し高密度実装と前記小型部品の保護と
を可能に構成したことを特徴とするプリント配線
基板。[Scope of claim for utility model registration] In a printed wiring board on which small parts such as chip-type parts or Melf-type parts are mounted, mounting holes for assembling the small parts such as the chip-type parts or Melf-type parts on the printed wiring board. 1. A printed wiring board characterized in that the printed wiring board is configured to enable high-density mounting and protection of the small components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11920587U JPS6424877U (en) | 1987-08-05 | 1987-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11920587U JPS6424877U (en) | 1987-08-05 | 1987-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424877U true JPS6424877U (en) | 1989-02-10 |
Family
ID=31364234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11920587U Pending JPS6424877U (en) | 1987-08-05 | 1987-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424877U (en) |
-
1987
- 1987-08-05 JP JP11920587U patent/JPS6424877U/ja active Pending