JPH0397972U - - Google Patents
Info
- Publication number
- JPH0397972U JPH0397972U JP623290U JP623290U JPH0397972U JP H0397972 U JPH0397972 U JP H0397972U JP 623290 U JP623290 U JP 623290U JP 623290 U JP623290 U JP 623290U JP H0397972 U JPH0397972 U JP H0397972U
- Authority
- JP
- Japan
- Prior art keywords
- landless
- holes
- mounting
- wiring board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は上面図、第３図はこの考案の他の実施例で
実装用パツドを複数個のスルーホール等で構成し
た上面図、第４図は従来の実施例を示す断面図で
ある。図において、１……プリント配線板、２…
…チツプ形電気部品、３……スルーホール、４…
…インタステイシヤルバイアホール、５……注入
半田フイレツト、６……接続パターン、７……銅
箔パツド、８……フラツトリード形部品、９……
フラツトリード端子、１０……スルーホールラン
ド、１１……充填半田、１２……接合半田。なお
、図中、同一符号は同一、又は相当部分を示す。
Fig. 1 is a sectional view showing one embodiment of this invention, Fig. 2 is a top view, and Fig. 3 is a top view of another embodiment of this invention in which the mounting pad is composed of a plurality of through holes, etc. FIG. 4 is a sectional view showing a conventional embodiment. In the figure, 1... printed wiring board, 2...
...Chip type electric component, 3...Through hole, 4...
...Interstitial via hole, 5...Injection solder fillet, 6...Connection pattern, 7...Copper foil pad, 8...Flat lead type part, 9...
Flat lead terminal, 10... Through hole land, 11... Filling solder, 12... Joining solder. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
をなくして、代りにランドレススルーホールやラ
ンドレスのインタステイシヤルバイアホール上に
実装することを特徴とするプリント配線板。 A printed wiring board characterized by eliminating a copper foil pad for mounting chip-shaped electrical components and instead mounting them on landless through holes or landless interstitial via holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623290U JPH0397972U (en) | 1990-01-26 | 1990-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623290U JPH0397972U (en) | 1990-01-26 | 1990-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397972U true JPH0397972U (en) | 1991-10-09 |
Family
ID=31509910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP623290U Pending JPH0397972U (en) | 1990-01-26 | 1990-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397972U (en) |
-
1990
- 1990-01-26 JP JP623290U patent/JPH0397972U/ja active Pending