JPS6181181U - - Google Patents
Info
- Publication number
- JPS6181181U JPS6181181U JP16715984U JP16715984U JPS6181181U JP S6181181 U JPS6181181 U JP S6181181U JP 16715984 U JP16715984 U JP 16715984U JP 16715984 U JP16715984 U JP 16715984U JP S6181181 U JPS6181181 U JP S6181181U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic components
- soldered
- wired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Channel Selection Circuits, Automatic Tuning Circuits (AREA)
Description
第１図及び第２図は本考案の一実施例を示す組
立前及び組立後の部分斜視図、第３図は第１図の
プリント基板の裏面図、第４図は第２図のＡ−Ａ
線に沿う断面図である。第５図及び第６図は従来
のプリント配線体の組立前及び組立後の部分斜視
図、第７図は第５図のプリント基板の裏面図、第
８図は第６図のＢ−Ｂ線に沿う断面図、第９図は
ＵＨＦチユーナのローカル回路図である。
１０……プリント基板、１１，１１ａ，１１ｂ
，１１ｃ……貫通穴、１２ａ，１２ｂ，１２ｃ…
…導電ランド、Ｄ２……電子部品（チツプ状ダイ
オード）、Ｃ１，Ｃ２……電子部品（ウエツジコ
ンデンサ）。
1 and 2 are partial perspective views showing an embodiment of the present invention before and after assembly, FIG. 3 is a back view of the printed circuit board in FIG. 1, and FIG. 4 is a A
It is a sectional view along a line. 5 and 6 are partial perspective views of a conventional printed circuit board before and after assembly, FIG. 7 is a back view of the printed circuit board shown in FIG. 5, and FIG. 8 is taken along line B-B in FIG. 6. FIG. 9 is a local circuit diagram of the UHF tuner. 10...Printed circuit board, 11, 11a, 11b
, 11c...through hole, 12a, 12b, 12c...
...Conductive land, D2 ...Electronic component (chip diode), C1 , C2 ...Electronic component (wedge capacitor).
Claims (1)
を、各部品毎に且つ互いに連通させてプリント基
板に形成した貫通孔に収納し、これら電子部品の
電極を前記プリント基板に形成した導電ランドに
半田付けして配線したことを特徴とするプリント
配線体。 A plurality of electronic components arranged close to each other are housed in through holes formed on a printed circuit board so that each component communicates with each other, and the electrodes of these electronic components are soldered to conductive lands formed on the printed circuit board. A printed wiring body characterized by being attached and wired.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16715984U JPS6181181U (en) | 1984-11-01 | 1984-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16715984U JPS6181181U (en) | 1984-11-01 | 1984-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181181U true JPS6181181U (en) | 1986-05-29 |
Family
ID=30724962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16715984U Pending JPS6181181U (en) | 1984-11-01 | 1984-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181181U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115391A (en) * | 1979-02-27 | 1980-09-05 | Sanyo Electric Co | Circuit device |
| JPS57130495A (en) * | 1981-02-04 | 1982-08-12 | Matsushita Electric Ind Co Ltd | Method of producing electric part mounting substrate |
-
1984
- 1984-11-01 JP JP16715984U patent/JPS6181181U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115391A (en) * | 1979-02-27 | 1980-09-05 | Sanyo Electric Co | Circuit device |
| JPS57130495A (en) * | 1981-02-04 | 1982-08-12 | Matsushita Electric Ind Co Ltd | Method of producing electric part mounting substrate |