JPS6371578U - - Google Patents
Info
- Publication number
- JPS6371578U JPS6371578U JP16703686U JP16703686U JPS6371578U JP S6371578 U JPS6371578 U JP S6371578U JP 16703686 U JP16703686 U JP 16703686U JP 16703686 U JP16703686 U JP 16703686U JP S6371578 U JPS6371578 U JP S6371578U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- resist layer
- solder resist
- foil land
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
Description
第１図は本考案に係るプリント基板の一実施例
を示す側面断面図、第２図は同上装置に部品を取
り付けた状態の一実施例を示す側面断面図、第３
図及び第４図は従来のプリント基板を示す側面断
面図、第５図は同上従来基板を半田デイツプした
状態を示す側面断面図、第６図は同上従来基板に
部品を装着した状態を示す側面断面図である。
１１……プリント基板、１２……スルーホール
、１３ａ，１３ｂ……銅箔ランド、１４……第１
のソルダーレジスト層、１５……半田層、１６…
…第２のソルダーレジスト層。
FIG. 1 is a side sectional view showing an embodiment of a printed circuit board according to the present invention, FIG. 2 is a side sectional view showing an embodiment of the same device with components attached to it, and FIG.
4 and 4 are side cross-sectional views showing a conventional printed circuit board, FIG. 5 is a side cross-sectional view showing a state in which the same conventional board is soldered-dipped, and FIG. 6 is a side cross-sectional view showing a state in which parts are mounted on the same conventional board. FIG. 11... Printed circuit board, 12... Through hole, 13a, 13b... Copper foil land, 14... First
Solder resist layer, 15...Solder layer, 16...
...Second solder resist layer.
Claims (1)
残して第１のソルダーレジスト層が施され、かつ
、上記スルーホールの内周面及び上記銅箔ランド
上面に半田層の施されたプリント基板において、 上記半田層の施された銅箔ランド上面に第２の
ソルダーレジスト層を形成したことを特徴とする
プリント基板。[Claims for Utility Model Registration] A first solder resist layer is applied on the surface leaving at least a copper foil land in the through hole, and a solder resist layer is applied on the inner peripheral surface of the through hole and the upper surface of the copper foil land. A printed circuit board characterized in that a second solder resist layer is formed on the upper surface of the copper foil land on which the solder layer is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16703686U JPS6371578U (en) | 1986-10-30 | 1986-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16703686U JPS6371578U (en) | 1986-10-30 | 1986-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6371578U true JPS6371578U (en) | 1988-05-13 |
Family
ID=31098587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16703686U Pending JPS6371578U (en) | 1986-10-30 | 1986-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6371578U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013031258A1 (en) * | 2011-09-01 | 2013-03-07 | 住友電装株式会社 | Printed circuit board |
-
1986
- 1986-10-30 JP JP16703686U patent/JPS6371578U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013031258A1 (en) * | 2011-09-01 | 2013-03-07 | 住友電装株式会社 | Printed circuit board |