JPS61192483U - - Google Patents
Info
- Publication number
- JPS61192483U JPS61192483U JP7613985U JP7613985U JPS61192483U JP S61192483 U JPS61192483 U JP S61192483U JP 7613985 U JP7613985 U JP 7613985U JP 7613985 U JP7613985 U JP 7613985U JP S61192483 U JPS61192483 U JP S61192483U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- multilayer printed
- pad surface
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例の斜視図、第２図は第
１図の部分貫通スルーホール部の拡大縦断面図、
第３図は従来のプリント基板の斜視図である。
１……多層プリント基板、２……部品取付用パ
ツド、３……部分貫通スルーホール、３′……ス
ルーホールの内面導体の端部、４……ソルダレジ
スト境界、５，５′……内層銅箔、６……部品取
付用パツド。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is an enlarged vertical cross-sectional view of a partially penetrated through-hole in FIG. 1,
FIG. 3 is a perspective view of a conventional printed circuit board. DESCRIPTION OF SYMBOLS 1...Multilayer printed circuit board, 2...Parts mounting pad, 3...Partial through hole, 3'...End of inner conductor of through hole, 4...Solder resist boundary, 5, 5'...Inner layer Copper foil, 6... Pad for mounting parts.
Claims (1)
ツドの両端部のそれぞれに、パツド面より多層プ
リント基板の一部の層を貫通し内面導体の端部が
パツド面に密着したスルーホールを有することを
特徴とするプリント基板。 (2) パツド面より多層プリント基板の一部の層
を貫通するスルーホールのうちの一方の上面がソ
ルダレジストにより被覆されていることを特徴と
する実用新案登録請求の範囲第１項記載のプリン
ト基板。[Scope of Claim for Utility Model Registration] (1) In a multilayer printed circuit board, at each end of a component mounting pad, an inner conductor that penetrates a part of the layer of the multilayer printed circuit board from the pad surface, and the end of the inner conductor is on the pad surface. A printed circuit board characterized by having through holes that are in close contact with each other. (2) The print according to claim 1 of the utility model registration claim, characterized in that the upper surface of one of the through holes that penetrate some layers of the multilayer printed circuit board from the pad surface is covered with a solder resist. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7613985U JPS61192483U (en) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7613985U JPS61192483U (en) | 1985-05-22 | 1985-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61192483U true JPS61192483U (en) | 1986-11-29 |
Family
ID=30618006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7613985U Pending JPS61192483U (en) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61192483U (en) |
-
1985
- 1985-05-22 JP JP7613985U patent/JPS61192483U/ja active Pending
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