JPS6242275U - - Google Patents
Info
- Publication number
- JPS6242275U JPS6242275U JP13291985U JP13291985U JPS6242275U JP S6242275 U JPS6242275 U JP S6242275U JP 13291985 U JP13291985 U JP 13291985U JP 13291985 U JP13291985 U JP 13291985U JP S6242275 U JPS6242275 U JP S6242275U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed circuit
- circuit board
- resist
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の第１実施例であり、同図Ａは
片面配線基板の斜視図、同図ＢはＸ―Ｘ断面図、
第２図は本考案の第２実施例であり、同図Ａは銅
スルホールメツキプリント基板の斜視図、同図Ｂ
は銅スルホールメツキを施した場合のＹ―Ｙ断面
図、第３図Ａは従来の片面配線基板の斜視図、同
図ＢはＺ―Ｚ断面図である。
１１，１５……基板、１２，１６……レジスト
、１３，１７，２１……銅箔、１４，１９……半
田、１８……銅スルホールメツキ、２０……スル
ホール。
Fig. 1 shows the first embodiment of the present invention, in which Fig. A is a perspective view of a single-sided wiring board, Fig. B is a sectional view taken along line XX,
Figure 2 shows a second embodiment of the present invention, and Figure A is a perspective view of a printed circuit board plated with copper through holes, and Figure B is a perspective view of a printed circuit board plated with copper through holes.
3A is a YY sectional view when copper through-hole plating is applied, FIG. 3A is a perspective view of a conventional single-sided wiring board, and FIG. 3B is a ZZ sectional view. 11,15...Substrate, 12,16...Resist, 13,17,21...Copper foil, 14,19...Solder, 18...Copper through hole plating, 20...Through hole.
Claims (1)
パターン上にレジストを設けたプリント基板にお
いて、前記パターン上で、少なくとも幅狭のパタ
ーン上にはレジストを設けず、導電物を設けたこ
とを特徴とするプリント基板。 A printed circuit board in which a pattern is formed on a substrate and a resist is provided on the pattern except for lands, characterized in that no resist is provided on at least a narrow pattern on the pattern, and a conductive material is provided on the pattern. printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13291985U JPS6242275U (en) | 1985-08-30 | 1985-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13291985U JPS6242275U (en) | 1985-08-30 | 1985-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6242275U true JPS6242275U (en) | 1987-03-13 |
Family
ID=31032753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13291985U Pending JPS6242275U (en) | 1985-08-30 | 1985-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242275U (en) |
-
1985
- 1985-08-30 JP JP13291985U patent/JPS6242275U/ja active Pending