JPH03117868U - - Google Patents
Info
- Publication number
- JPH03117868U JPH03117868U JP2698690U JP2698690U JPH03117868U JP H03117868 U JPH03117868 U JP H03117868U JP 2698690 U JP2698690 U JP 2698690U JP 2698690 U JP2698690 U JP 2698690U JP H03117868 U JPH03117868 U JP H03117868U
- Authority
- JP
- Japan
- Prior art keywords
- coated
- solder
- substrate
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例の半田コートされた
スルホールの断面図、第２図は従来の印刷配線板
の半田コートを施したスルホールの一例の断面図
である。
１……銅箔、２……銅めつき、３……文字イン
ク、４……半田、５……ソルダーレジスト、６…
…基板、７……スルホール。
FIG. 1 is a cross-sectional view of a solder-coated through hole according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of an example of a solder-coated through hole of a conventional printed wiring board. 1...Copper foil, 2...Copper plating, 3...Character ink, 4...Solder, 5...Solder resist, 6...
...Substrate, 7...Through hole.
Claims (1)
施す印刷配線板において、前記スルホールの銅め
つき上を全て半田コートし、前記基板上の両面に
形成されたランドのうちの一方のランドが文字印
刷インクで覆われていることを特徴とする印刷配
線板。 In a printed wiring board in which through-holes formed on a substrate are coated with solder, the entire copper-plated surface of the through-holes is coated with solder, and one of the lands formed on both sides of the substrate is coated with character printing ink. A printed wiring board characterized by being covered with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2698690U JPH03117868U (en) | 1990-03-16 | 1990-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2698690U JPH03117868U (en) | 1990-03-16 | 1990-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117868U true JPH03117868U (en) | 1991-12-05 |
Family
ID=31529860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2698690U Pending JPH03117868U (en) | 1990-03-16 | 1990-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117868U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998584A (en) * | 1983-11-01 | 1984-06-06 | 松下電器産業株式会社 | Printed circuit board |
-
1990
- 1990-03-16 JP JP2698690U patent/JPH03117868U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998584A (en) * | 1983-11-01 | 1984-06-06 | 松下電器産業株式会社 | Printed circuit board |
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