JPS6142874U - wiring circuit board - Google Patents
wiring circuit boardInfo
- Publication number
- JPS6142874U JPS6142874U JP12744084U JP12744084U JPS6142874U JP S6142874 U JPS6142874 U JP S6142874U JP 12744084 U JP12744084 U JP 12744084U JP 12744084 U JP12744084 U JP 12744084U JP S6142874 U JPS6142874 U JP S6142874U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- wiring circuit
- hole
- conductor
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第１図は、この考案の実施例を示す配線回路基板の平面
図、第２図は、同基板の端縁部の一部を切断した状態の
平面図、第３図は、厚さ方向を拡大して示した第２図の
Ａ−Ａ線断面図である。
１・・・基板、２・・・スルーホール、２ａ・・・溝、
３・・・スルーホールランド、７・・・溶融半田に対す
る濡れ性の悪い導体。[Brief Description of the Drawings] Fig. 1 is a plan view of a printed circuit board showing an embodiment of this invention, Fig. 2 is a plan view of the printed circuit board with a part of the edge section cut away, and Fig. 3 is a plan view of a printed circuit board showing an embodiment of the invention. The figure is a cross-sectional view taken along the line A-A in FIG. 2, showing an enlarged view in the thickness direction. 1... Board, 2... Through hole, 2a... Groove,
3... Through-hole land, 7... Conductor with poor wettability to molten solder.
Claims (1)
ドが、スルーホールもしくは溝の壁面に塗布された導体
で互いに接続された配線回路基板において、前記スルー
ホールもしくは溝の壁面に塗布された導体の少なくとも
外面が、溶融半田に対する濡れ性の悪い導体で形成され
ていることを特徴とす乞配線回路基板。In a printed circuit board in which through-hole lands formed at opposing positions on both sides of the board are connected to each other by a conductor coated on the wall surface of the through hole or groove, the conductor land coated on the wall surface of the through hole or groove is 1. A printed circuit board characterized in that at least the outer surface is formed of a conductor that has poor wettability with molten solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12744084U JPS6142874U (en) | 1984-08-22 | 1984-08-22 | wiring circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12744084U JPS6142874U (en) | 1984-08-22 | 1984-08-22 | wiring circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6142874U true JPS6142874U (en) | 1986-03-19 |
Family
ID=30686084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12744084U Pending JPS6142874U (en) | 1984-08-22 | 1984-08-22 | wiring circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6142874U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626487A (en) * | 1980-01-21 | 1981-03-14 | Futaba Denshi Kogyo Kk | Bothhside wiring board |
-
1984
- 1984-08-22 JP JP12744084U patent/JPS6142874U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626487A (en) * | 1980-01-21 | 1981-03-14 | Futaba Denshi Kogyo Kk | Bothhside wiring board |
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