JPH0281076U - - Google Patents
Info
- Publication number
- JPH0281076U JPH0281076U JP16056988U JP16056988U JPH0281076U JP H0281076 U JPH0281076 U JP H0281076U JP 16056988 U JP16056988 U JP 16056988U JP 16056988 U JP16056988 U JP 16056988U JP H0281076 U JPH0281076 U JP H0281076U
- Authority
- JP
- Japan
- Prior art keywords
- attached
- copper foil
- solder resist
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は、本考案の一実施例を示す部分拡大図
であり、同図ａは正面図、同図ｂは右側面（断面
）図である。第２図は、従来のプリント板例の部
分拡大図であり、同図ａは正面図、同図ｂは右側
面（断面）図である。
１……銅箔文字部分、２……ソルダレジストを
塗布しない空白部分、３……積層板、４……ソル
ダレジスト。
FIG. 1 is a partially enlarged view showing an embodiment of the present invention, in which FIG. 1A is a front view and FIG. 1B is a right side (cross-sectional) view. FIG. 2 is a partially enlarged view of an example of a conventional printed circuit board, in which FIG. 2A is a front view and FIG. 2B is a right side (cross-sectional) view. 1... Copper foil character part, 2... Blank area where solder resist is not applied, 3... Laminate board, 4... Solder resist.
Claims (1)
を有する側の表面に、はんだに浸したとき、はん
だめつきされないようソルダレジストを付着させ
るプリント配線基板において、前記ソルダレジス
トを付着させる部分に、少なくとも前記銅箔文字
類を形成した部分を含まないことを特徴とするプ
リント配線基板。 In a printed wiring board in which a solder resist is attached to the surface of the side having a portion on which a wiring pattern and copper foil characters are formed to prevent soldering when immersed in solder, at least the portion to which the solder resist is attached is attached. A printed wiring board characterized in that it does not include a portion on which the copper foil characters are formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16056988U JPH0281076U (en) | 1988-12-09 | 1988-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16056988U JPH0281076U (en) | 1988-12-09 | 1988-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281076U true JPH0281076U (en) | 1990-06-22 |
Family
ID=31442747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16056988U Pending JPH0281076U (en) | 1988-12-09 | 1988-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281076U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005142405A (en) * | 2003-11-07 | 2005-06-02 | Orion Denki Kk | Electronic equipment equipped with printed board to improve luminance of led |
| JP5799138B1 (en) * | 2014-06-09 | 2015-10-21 | ▲き▼邦科技股▲分▼有限公司 | Flexible substrate |
-
1988
- 1988-12-09 JP JP16056988U patent/JPH0281076U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005142405A (en) * | 2003-11-07 | 2005-06-02 | Orion Denki Kk | Electronic equipment equipped with printed board to improve luminance of led |
| JP5799138B1 (en) * | 2014-06-09 | 2015-10-21 | ▲き▼邦科技股▲分▼有限公司 | Flexible substrate |